JPS51120176A - Method of evaluating bonding characteristic of metal surfaces of micro electric parts - Google Patents

Method of evaluating bonding characteristic of metal surfaces of micro electric parts

Info

Publication number
JPS51120176A
JPS51120176A JP50045022A JP4502275A JPS51120176A JP S51120176 A JPS51120176 A JP S51120176A JP 50045022 A JP50045022 A JP 50045022A JP 4502275 A JP4502275 A JP 4502275A JP S51120176 A JPS51120176 A JP S51120176A
Authority
JP
Japan
Prior art keywords
metal surfaces
electric parts
bonding characteristic
micro electric
evaluating bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50045022A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5424823B2 (2
Inventor
Wataru Shimada
Takashi Kondo
Yoshifusa Ogawa
Mieko Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP50045022A priority Critical patent/JPS51120176A/ja
Publication of JPS51120176A publication Critical patent/JPS51120176A/ja
Publication of JPS5424823B2 publication Critical patent/JPS5424823B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Wire Bonding (AREA)
JP50045022A 1975-04-14 1975-04-14 Method of evaluating bonding characteristic of metal surfaces of micro electric parts Granted JPS51120176A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50045022A JPS51120176A (en) 1975-04-14 1975-04-14 Method of evaluating bonding characteristic of metal surfaces of micro electric parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50045022A JPS51120176A (en) 1975-04-14 1975-04-14 Method of evaluating bonding characteristic of metal surfaces of micro electric parts

Publications (2)

Publication Number Publication Date
JPS51120176A true JPS51120176A (en) 1976-10-21
JPS5424823B2 JPS5424823B2 (2) 1979-08-23

Family

ID=12707700

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50045022A Granted JPS51120176A (en) 1975-04-14 1975-04-14 Method of evaluating bonding characteristic of metal surfaces of micro electric parts

Country Status (1)

Country Link
JP (1) JPS51120176A (2)

Also Published As

Publication number Publication date
JPS5424823B2 (2) 1979-08-23

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