JPS51123782A - A sputtering apparatus - Google Patents

A sputtering apparatus

Info

Publication number
JPS51123782A
JPS51123782A JP4866575A JP4866575A JPS51123782A JP S51123782 A JPS51123782 A JP S51123782A JP 4866575 A JP4866575 A JP 4866575A JP 4866575 A JP4866575 A JP 4866575A JP S51123782 A JPS51123782 A JP S51123782A
Authority
JP
Japan
Prior art keywords
sputtering apparatus
sputtering
base plate
apparatus provided
plate holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4866575A
Other languages
Japanese (ja)
Inventor
Tomikatsu Watanabe
Mitsuru Otake
Fumihiro Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4866575A priority Critical patent/JPS51123782A/en
Publication of JPS51123782A publication Critical patent/JPS51123782A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3435—Target holders (includes backing plates and endblocks)
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:A sputtering apparatus provided with a base plate holder capable of easily removing the soils deposited during sputtering.
JP4866575A 1975-04-23 1975-04-23 A sputtering apparatus Pending JPS51123782A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4866575A JPS51123782A (en) 1975-04-23 1975-04-23 A sputtering apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4866575A JPS51123782A (en) 1975-04-23 1975-04-23 A sputtering apparatus

Publications (1)

Publication Number Publication Date
JPS51123782A true JPS51123782A (en) 1976-10-28

Family

ID=12809616

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4866575A Pending JPS51123782A (en) 1975-04-23 1975-04-23 A sputtering apparatus

Country Status (1)

Country Link
JP (1) JPS51123782A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08277469A (en) * 1995-04-06 1996-10-22 Japan Energy Corp Wafer clamp device recycling method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08277469A (en) * 1995-04-06 1996-10-22 Japan Energy Corp Wafer clamp device recycling method

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