JPS51133383A - A process for manufacturing copper-clad laminate - Google Patents

A process for manufacturing copper-clad laminate

Info

Publication number
JPS51133383A
JPS51133383A JP5745075A JP5745075A JPS51133383A JP S51133383 A JPS51133383 A JP S51133383A JP 5745075 A JP5745075 A JP 5745075A JP 5745075 A JP5745075 A JP 5745075A JP S51133383 A JPS51133383 A JP S51133383A
Authority
JP
Japan
Prior art keywords
clad laminate
manufacturing copper
manufacturing
copper
bending
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5745075A
Other languages
Japanese (ja)
Inventor
Daisuke Atobe
Masaya Imai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Shokubai Co Ltd
Original Assignee
Nippon Shokubai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Shokubai Co Ltd filed Critical Nippon Shokubai Co Ltd
Priority to JP5745075A priority Critical patent/JPS51133383A/en
Publication of JPS51133383A publication Critical patent/JPS51133383A/en
Pending legal-status Critical Current

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  • Laminated Bodies (AREA)

Abstract

PURPOSE: A process for manufacturing a copper-clad laminate without crack initiation on bending useful as a printed circuit board base, by hot pressing an unsaturated polyester resin prepreg with an epoxy resin adhesive treated copper foil.
COPYRIGHT: (C)1976,JPO&Japio
JP5745075A 1975-05-16 1975-05-16 A process for manufacturing copper-clad laminate Pending JPS51133383A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5745075A JPS51133383A (en) 1975-05-16 1975-05-16 A process for manufacturing copper-clad laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5745075A JPS51133383A (en) 1975-05-16 1975-05-16 A process for manufacturing copper-clad laminate

Publications (1)

Publication Number Publication Date
JPS51133383A true JPS51133383A (en) 1976-11-19

Family

ID=13055992

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5745075A Pending JPS51133383A (en) 1975-05-16 1975-05-16 A process for manufacturing copper-clad laminate

Country Status (1)

Country Link
JP (1) JPS51133383A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55137965A (en) * 1979-04-14 1980-10-28 Kanegafuchi Chemical Ind Thermal hardening resin composition* laminated board for electric work which use said composition and its preparation
JPS60127348A (en) * 1983-12-12 1985-07-08 Kanegafuchi Chem Ind Co Ltd Epoxy resin composition and electrical laminated board

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5170457A (en) * 1974-12-16 1976-06-18 Mitsubishi Gas Chemical Co Sekisoban oyobi sonoseiho

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5170457A (en) * 1974-12-16 1976-06-18 Mitsubishi Gas Chemical Co Sekisoban oyobi sonoseiho

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55137965A (en) * 1979-04-14 1980-10-28 Kanegafuchi Chemical Ind Thermal hardening resin composition* laminated board for electric work which use said composition and its preparation
JPS60127348A (en) * 1983-12-12 1985-07-08 Kanegafuchi Chem Ind Co Ltd Epoxy resin composition and electrical laminated board

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