JPS51136176A - Method of manufacturing printed circuit board - Google Patents

Method of manufacturing printed circuit board

Info

Publication number
JPS51136176A
JPS51136176A JP50114378A JP11437875A JPS51136176A JP S51136176 A JPS51136176 A JP S51136176A JP 50114378 A JP50114378 A JP 50114378A JP 11437875 A JP11437875 A JP 11437875A JP S51136176 A JPS51136176 A JP S51136176A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
manufacturing printed
manufacturing
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50114378A
Other languages
Japanese (ja)
Other versions
JPS556318B2 (en
Inventor
Jiyon Uorushiyu Mashiyuu
Ruisu Gaisaa Furederitsuku
Noomando Maakotsute Robaato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nortel Networks Ltd
Original Assignee
Northern Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Northern Electric Co Ltd filed Critical Northern Electric Co Ltd
Publication of JPS51136176A publication Critical patent/JPS51136176A/en
Publication of JPS556318B2 publication Critical patent/JPS556318B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/282Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0097Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0147Carriers and holders
    • H05K2203/0165Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP50114378A 1974-09-23 1975-09-23 Method of manufacturing printed circuit board Granted JPS51136176A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CA209,786A CA1009027A (en) 1974-09-23 1974-09-23 Method of producing printed circuit boards in multiple units

Publications (2)

Publication Number Publication Date
JPS51136176A true JPS51136176A (en) 1976-11-25
JPS556318B2 JPS556318B2 (en) 1980-02-15

Family

ID=4101198

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50114378A Granted JPS51136176A (en) 1974-09-23 1975-09-23 Method of manufacturing printed circuit board

Country Status (7)

Country Link
JP (1) JPS51136176A (en)
CA (1) CA1009027A (en)
DE (1) DE2541667A1 (en)
FR (1) FR2285784A1 (en)
GB (1) GB1474504A (en)
NL (1) NL7511148A (en)
SE (1) SE7510670L (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59181090A (en) * 1983-03-30 1984-10-15 日本メクトロン株式会社 Method of producing circuit board

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06338671A (en) * 1993-05-31 1994-12-06 Sankyo Seiki Mfg Co Ltd Manufacture of printed board
NL1016701C2 (en) * 2000-11-24 2002-05-27 Fico Bv Method and device for removing a carrier part from a flat carrier.
CN103817745B (en) * 2014-02-24 2016-05-25 昆山苏杭电路板有限公司 Junior unit printed board punching technique
DE102015116563A1 (en) 2015-09-30 2017-03-30 Valeo Schalter Und Sensoren Gmbh Method for producing electronic components for sensors of a motor vehicle

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59181090A (en) * 1983-03-30 1984-10-15 日本メクトロン株式会社 Method of producing circuit board

Also Published As

Publication number Publication date
NL7511148A (en) 1976-03-25
GB1474504A (en) 1977-05-25
DE2541667A1 (en) 1976-04-08
FR2285784A1 (en) 1976-04-16
CA1009027A (en) 1977-04-26
JPS556318B2 (en) 1980-02-15
SE7510670L (en) 1976-03-24

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