JPS51137751A - Silico ne resin composition for use in laminating - Google Patents
Silico ne resin composition for use in laminatingInfo
- Publication number
- JPS51137751A JPS51137751A JP6262375A JP6262375A JPS51137751A JP S51137751 A JPS51137751 A JP S51137751A JP 6262375 A JP6262375 A JP 6262375A JP 6262375 A JP6262375 A JP 6262375A JP S51137751 A JPS51137751 A JP S51137751A
- Authority
- JP
- Japan
- Prior art keywords
- laminating
- resin composition
- silico
- resin
- compounding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010030 laminating Methods 0.000 title abstract 2
- 239000011342 resin composition Substances 0.000 title abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 239000011347 resin Substances 0.000 abstract 2
- 238000013329 compounding Methods 0.000 abstract 1
- 229920006136 organohydrogenpolysiloxane Polymers 0.000 abstract 1
- 229920001296 polysiloxane Polymers 0.000 abstract 1
- 229920002050 silicone resin Polymers 0.000 abstract 1
Landscapes
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
PURPOSE: A silicone resin composition for use in laminating with improved transparency and machanical properties, prepared by compounding an organopolysiloxane resin with an organohydrogenpolysiloxane resin a specified proportion.
COPYRIGHT: (C)1976,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6262375A JPS51137751A (en) | 1975-05-26 | 1975-05-26 | Silico ne resin composition for use in laminating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6262375A JPS51137751A (en) | 1975-05-26 | 1975-05-26 | Silico ne resin composition for use in laminating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS51137751A true JPS51137751A (en) | 1976-11-27 |
Family
ID=13205618
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6262375A Pending JPS51137751A (en) | 1975-05-26 | 1975-05-26 | Silico ne resin composition for use in laminating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS51137751A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002194122A (en) * | 2000-12-25 | 2002-07-10 | Kanegafuchi Chem Ind Co Ltd | Silsesquioxane polymer and polycarbosilane composite prepreg, and laminate using the same |
| JP2007191629A (en) * | 2006-01-20 | 2007-08-02 | Shin Etsu Chem Co Ltd | Thermosetting composition |
| JP2007246842A (en) * | 2006-03-17 | 2007-09-27 | Shin Etsu Chem Co Ltd | Thermosetting composition and film provided with a layer obtained from the composition |
| JP2010159411A (en) * | 2008-12-12 | 2010-07-22 | Nitto Denko Corp | Semi-cured silicone resin sheet |
| JP2010174220A (en) * | 2009-02-02 | 2010-08-12 | Nitto Denko Corp | Thermosetting silicone resin composition |
| JP2010265436A (en) * | 2009-04-14 | 2010-11-25 | Nitto Denko Corp | Composition for thermosetting silicone resin |
| JP2010285593A (en) * | 2008-12-12 | 2010-12-24 | Nitto Denko Corp | Composition for thermosetting silicone resin |
| JP2011526648A (en) * | 2008-06-26 | 2011-10-13 | ダウ・コーニング・コーポレイション | Method for forming curable adhesive tape and method for forming insulating layer on conductive substrate |
| JP2012012563A (en) * | 2010-06-02 | 2012-01-19 | Nitto Denko Corp | Composition for thermosetting silicone resin |
-
1975
- 1975-05-26 JP JP6262375A patent/JPS51137751A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002194122A (en) * | 2000-12-25 | 2002-07-10 | Kanegafuchi Chem Ind Co Ltd | Silsesquioxane polymer and polycarbosilane composite prepreg, and laminate using the same |
| JP2007191629A (en) * | 2006-01-20 | 2007-08-02 | Shin Etsu Chem Co Ltd | Thermosetting composition |
| JP2007246842A (en) * | 2006-03-17 | 2007-09-27 | Shin Etsu Chem Co Ltd | Thermosetting composition and film provided with a layer obtained from the composition |
| KR101136673B1 (en) * | 2006-03-17 | 2012-04-18 | 신에쓰 가가꾸 고교 가부시끼가이샤 | Thermosetting composition and film having the layer obtained therefrom |
| JP2011526648A (en) * | 2008-06-26 | 2011-10-13 | ダウ・コーニング・コーポレイション | Method for forming curable adhesive tape and method for forming insulating layer on conductive substrate |
| JP2010159411A (en) * | 2008-12-12 | 2010-07-22 | Nitto Denko Corp | Semi-cured silicone resin sheet |
| JP2010285593A (en) * | 2008-12-12 | 2010-12-24 | Nitto Denko Corp | Composition for thermosetting silicone resin |
| JP2010174220A (en) * | 2009-02-02 | 2010-08-12 | Nitto Denko Corp | Thermosetting silicone resin composition |
| JP2010265436A (en) * | 2009-04-14 | 2010-11-25 | Nitto Denko Corp | Composition for thermosetting silicone resin |
| JP2010265442A (en) * | 2009-04-14 | 2010-11-25 | Nitto Denko Corp | Composition for thermosetting silicone resin |
| JP2012012563A (en) * | 2010-06-02 | 2012-01-19 | Nitto Denko Corp | Composition for thermosetting silicone resin |
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