JPS51138160A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS51138160A
JPS51138160A JP50061595A JP6159575A JPS51138160A JP S51138160 A JPS51138160 A JP S51138160A JP 50061595 A JP50061595 A JP 50061595A JP 6159575 A JP6159575 A JP 6159575A JP S51138160 A JPS51138160 A JP S51138160A
Authority
JP
Japan
Prior art keywords
semiconductor device
semiconductor element
theral
solders
lump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50061595A
Other languages
Japanese (ja)
Inventor
Manabu Bonshihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP50061595A priority Critical patent/JPS51138160A/en
Publication of JPS51138160A publication Critical patent/JPS51138160A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To prevent the destruction of the semiconductor element due to theral expansion, by arranging, in stock work, wires or a lump-like substance having a small thermal expansion factors into the soldering material which solders the semiconductor element to the element fixing portion.
COPYRIGHT: (C)1976,JPO&Japio
JP50061595A 1975-05-23 1975-05-23 Semiconductor device Pending JPS51138160A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50061595A JPS51138160A (en) 1975-05-23 1975-05-23 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50061595A JPS51138160A (en) 1975-05-23 1975-05-23 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS51138160A true JPS51138160A (en) 1976-11-29

Family

ID=13175652

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50061595A Pending JPS51138160A (en) 1975-05-23 1975-05-23 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS51138160A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4917971A (en) * 1972-06-07 1974-02-16
JPS5052983A (en) * 1973-09-10 1975-05-10

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4917971A (en) * 1972-06-07 1974-02-16
JPS5052983A (en) * 1973-09-10 1975-05-10

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