JPS51142148U - - Google Patents

Info

Publication number
JPS51142148U
JPS51142148U JP1975063350U JP6335075U JPS51142148U JP S51142148 U JPS51142148 U JP S51142148U JP 1975063350 U JP1975063350 U JP 1975063350U JP 6335075 U JP6335075 U JP 6335075U JP S51142148 U JPS51142148 U JP S51142148U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1975063350U
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1975063350U priority Critical patent/JPS51142148U/ja
Publication of JPS51142148U publication Critical patent/JPS51142148U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP1975063350U 1975-05-10 1975-05-10 Pending JPS51142148U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1975063350U JPS51142148U (ja) 1975-05-10 1975-05-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1975063350U JPS51142148U (ja) 1975-05-10 1975-05-10

Publications (1)

Publication Number Publication Date
JPS51142148U true JPS51142148U (ja) 1976-11-16

Family

ID=28526535

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1975063350U Pending JPS51142148U (ja) 1975-05-10 1975-05-10

Country Status (1)

Country Link
JP (1) JPS51142148U (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4816298U (ja) * 1971-07-06 1973-02-23

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4816298U (ja) * 1971-07-06 1973-02-23

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