JPS51144453A - Preparation of polyamide resin chips - Google Patents
Preparation of polyamide resin chipsInfo
- Publication number
- JPS51144453A JPS51144453A JP6851175A JP6851175A JPS51144453A JP S51144453 A JPS51144453 A JP S51144453A JP 6851175 A JP6851175 A JP 6851175A JP 6851175 A JP6851175 A JP 6851175A JP S51144453 A JPS51144453 A JP S51144453A
- Authority
- JP
- Japan
- Prior art keywords
- preparation
- polyamide resin
- resin chips
- chips
- stearylalcohol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920006122 polyamide resin Polymers 0.000 title 1
- GLDOVTGHNKAZLK-UHFFFAOYSA-N octadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCCCO GLDOVTGHNKAZLK-UHFFFAOYSA-N 0.000 abstract 2
- 239000004952 Polyamide Substances 0.000 abstract 1
- 239000002202 Polyethylene glycol Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 238000000465 moulding Methods 0.000 abstract 1
- GOQYKNQRPGWPLP-UHFFFAOYSA-N n-heptadecyl alcohol Natural products CCCCCCCCCCCCCCCCCO GOQYKNQRPGWPLP-UHFFFAOYSA-N 0.000 abstract 1
- 229920002647 polyamide Polymers 0.000 abstract 1
- 229920001223 polyethylene glycol Polymers 0.000 abstract 1
- 239000007787 solid Substances 0.000 abstract 1
- 229940012831 stearyl alcohol Drugs 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
Landscapes
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6851175A JPS51144453A (en) | 1975-06-09 | 1975-06-09 | Preparation of polyamide resin chips |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6851175A JPS51144453A (en) | 1975-06-09 | 1975-06-09 | Preparation of polyamide resin chips |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS51144453A true JPS51144453A (en) | 1976-12-11 |
Family
ID=13375802
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6851175A Pending JPS51144453A (en) | 1975-06-09 | 1975-06-09 | Preparation of polyamide resin chips |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS51144453A (ja) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54103460A (en) * | 1978-02-02 | 1979-08-14 | Toray Ind Inc | Moldable polyamide resin composition |
| JPS61188458A (ja) * | 1985-02-15 | 1986-08-22 | Asahi Chem Ind Co Ltd | 成形用ナイロン４６樹脂組成物 |
| JPS61188457A (ja) * | 1985-02-15 | 1986-08-22 | Asahi Chem Ind Co Ltd | 薄肉成形品用ポリアミド樹脂組成物 |
| JPS62116661A (ja) * | 1985-11-15 | 1987-05-28 | Daiseru Hiyurusu Kk | ポリアミド樹脂組成物 |
| GB2301105A (en) * | 1995-05-23 | 1996-11-27 | Bip Plastics Limited | Moulding compositions containing a polyamide |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4916748A (ja) * | 1972-06-02 | 1974-02-14 |
-
1975
- 1975-06-09 JP JP6851175A patent/JPS51144453A/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4916748A (ja) * | 1972-06-02 | 1974-02-14 |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54103460A (en) * | 1978-02-02 | 1979-08-14 | Toray Ind Inc | Moldable polyamide resin composition |
| JPS61188458A (ja) * | 1985-02-15 | 1986-08-22 | Asahi Chem Ind Co Ltd | 成形用ナイロン４６樹脂組成物 |
| JPS61188457A (ja) * | 1985-02-15 | 1986-08-22 | Asahi Chem Ind Co Ltd | 薄肉成形品用ポリアミド樹脂組成物 |
| JPS62116661A (ja) * | 1985-11-15 | 1987-05-28 | Daiseru Hiyurusu Kk | ポリアミド樹脂組成物 |
| GB2301105A (en) * | 1995-05-23 | 1996-11-27 | Bip Plastics Limited | Moulding compositions containing a polyamide |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS53282A (en) | Thermosetting resin, method of preparing same, and coating composition containing same as main component | |
| JPS5227436A (en) | Polyester resin composition for powder coating | |
| JPS5236588A (en) | Release agent | |
| JPS5273929A (en) | Resinous composition of powder coating | |
| JPS51144453A (en) | Preparation of polyamide resin chips | |
| JPS5219754A (en) | Preparation of crosslinked epihalohydrin polymer composition | |
| JPS51124197A (en) | A resin composition | |
| JPS5380000A (en) | Process for curing epoxy compound | |
| JPS5216534A (en) | Powder coating resin composition | |
| JPS524600A (en) | Curing of epoxy resin | |
| JPS5235227A (en) | Preparation of filters for adhesives | |
| JPS5250329A (en) | Adhesive composition | |
| JPS5235220A (en) | Thermosetting high solids coating composition | |
| JPS53127540A (en) | Adhesive composition | |
| JPS5263953A (en) | Preparation of polyhydroxy compositions | |
| JPS52898A (en) | Curable epoxy resin composition | |
| JPS52148599A (en) | Chelate-forming epoxy resin composition | |
| JPS5243832A (en) | Adhesive composition | |
| JPS524594A (en) | Preparation of molten polyamide resin | |
| JPS5231671A (en) | Sealing method of semiconductor device | |
| JPS51149344A (en) | Process of manufacturing polyolefin resin composition | |
| JPS5211298A (en) | Epoxy resin compositions | |
| JPS5216560A (en) | Degassing of polyurethane resin | |
| JPS51112866A (en) | Synthetic resin composition with high shock-resistance | |
| JPS51140990A (en) | Low-shrinking resin composition |