JPS51145370A - Electronic circuit package - Google Patents

Electronic circuit package

Info

Publication number
JPS51145370A
JPS51145370A JP51062158A JP6215876A JPS51145370A JP S51145370 A JPS51145370 A JP S51145370A JP 51062158 A JP51062158 A JP 51062158A JP 6215876 A JP6215876 A JP 6215876A JP S51145370 A JPS51145370 A JP S51145370A
Authority
JP
Japan
Prior art keywords
package
circuit device
electronic circuit
circuit package
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP51062158A
Other languages
Japanese (ja)
Inventor
Jii Haapaa Jieemuzu
Ii Burankenshitsupu Jiin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/581,604 external-priority patent/US3986334A/en
Priority claimed from US05/581,605 external-priority patent/US4012723A/en
Priority claimed from US05/581,603 external-priority patent/US3986335A/en
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of JPS51145370A publication Critical patent/JPS51145370A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G17/00—Structural details; Housings
    • G04G17/02—Component assemblies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Clocks (AREA)
  • Light Receiving Elements (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
  • Electromechanical Clocks (AREA)

Abstract

CIRCUIT DEVICE PACKAGING TECHNIQUE The package of a circuit device such as an integrated semiconductor circuit device is molded into a special shape to fit its function. The package includes leads extending from the circuit device to selected positions for interconnection both inside and outside the volume of the package such as for switch points or attachment of other electrical components to the circuit device. Support members or cavities are simultaneously molded directly into the package for the mechanical support of the other electrical, magnetic, optical or optoelectronic components. Also, optical elements such as lenses or filters may be molded directly into the package to carry out optical functions.
JP51062158A 1975-05-29 1976-05-28 Electronic circuit package Pending JPS51145370A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US58162075A 1975-05-29 1975-05-29
US05/581,604 US3986334A (en) 1975-05-29 1975-05-29 Electronic watch and its method of fabrication
US05/581,605 US4012723A (en) 1975-05-29 1975-05-29 Magnetic bubble memory packaging arrangement and its method of fabrication
US05/581,603 US3986335A (en) 1975-05-29 1975-05-29 Electronic watch module and its method of fabrication

Publications (1)

Publication Number Publication Date
JPS51145370A true JPS51145370A (en) 1976-12-14

Family

ID=27504954

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51062158A Pending JPS51145370A (en) 1975-05-29 1976-05-28 Electronic circuit package

Country Status (7)

Country Link
JP (1) JPS51145370A (en)
BR (1) BR7603423A (en)
CA (1) CA1058312A (en)
DE (1) DE2623715A1 (en)
FR (1) FR2356339A1 (en)
GB (1) GB1555364A (en)
IT (1) IT1062029B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5227555A (en) * 1975-08-27 1977-03-01 Seiko Instr & Electronics Electronic timekeeper
JPS5424673A (en) * 1977-07-27 1979-02-24 Seiko Epson Corp Electronic wristwatch
JPS56122972U (en) * 1980-02-19 1981-09-18

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4064552A (en) * 1976-02-03 1977-12-20 Angelucci Thomas L Multilayer flexible printed circuit tape
GB2000336B (en) * 1977-06-20 1982-07-07 Hitachi Ltd Electronic device and method of fabricating the same
CH623452B (en) * 1977-12-14 Fontainemelon Horlogerie METHOD OF MANUFACTURING AN ELECTRONIC CLOCK PART MODULE AND CLOCK PART MODULE OBTAINED BY IMPLEMENTATION OF THIS PROCESS.
EP0105841A1 (en) * 1982-10-05 1984-04-18 Ebauches Electroniques S.A. Strip used for manufacturing supports of components for watches
US5124782A (en) * 1990-01-26 1992-06-23 Sgs-Thomson Microelectronics, Inc. Integrated circuit package with molded cell
GB9615164D0 (en) * 1996-07-19 1996-09-04 Delta Schoeller Ltd Electrical circuit

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3611061A (en) * 1971-07-07 1971-10-05 Motorola Inc Multiple lead integrated circuit device and frame member for the fabrication thereof
US3784725A (en) * 1972-07-24 1974-01-08 Solitron Devices Electronic hybrid package

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5227555A (en) * 1975-08-27 1977-03-01 Seiko Instr & Electronics Electronic timekeeper
JPS5424673A (en) * 1977-07-27 1979-02-24 Seiko Epson Corp Electronic wristwatch
JPS56122972U (en) * 1980-02-19 1981-09-18

Also Published As

Publication number Publication date
GB1555364A (en) 1979-11-07
IT1062029B (en) 1983-06-25
BR7603423A (en) 1976-12-21
CA1058312A (en) 1979-07-10
DE2623715A1 (en) 1977-01-20
FR2356339A1 (en) 1978-01-20
FR2356339B1 (en) 1983-03-04

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