JPS51145988A - Apparatus for cutting a brittle material - Google Patents
Apparatus for cutting a brittle materialInfo
- Publication number
- JPS51145988A JPS51145988A JP6969475A JP6969475A JPS51145988A JP S51145988 A JPS51145988 A JP S51145988A JP 6969475 A JP6969475 A JP 6969475A JP 6969475 A JP6969475 A JP 6969475A JP S51145988 A JPS51145988 A JP S51145988A
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- brittle material
- incise
- whole
- processing time
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
- B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
- B23D57/0061—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of devices for guiding or feeding saw wires
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Dicing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6969475A JPS51145988A (en) | 1975-06-11 | 1975-06-11 | Apparatus for cutting a brittle material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6969475A JPS51145988A (en) | 1975-06-11 | 1975-06-11 | Apparatus for cutting a brittle material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS51145988A true JPS51145988A (en) | 1976-12-15 |
Family
ID=13410222
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6969475A Pending JPS51145988A (en) | 1975-06-11 | 1975-06-11 | Apparatus for cutting a brittle material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS51145988A (ja) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53111578A (en) * | 1977-03-10 | 1978-09-29 | Hitachi Ltd | Filter type dust collector |
| JPS6179562A (ja) * | 1984-09-26 | 1986-04-23 | Hirabayashi:Kk | 切断機の加重伝達装置 |
| JPH04122566A (ja) * | 1989-12-22 | 1992-04-23 | Wacker Chemitronic Ges Elektron Grundstoffe Mbh | バーまたはブロック状加工材からのウェファー切断用ワイヤーソー |
-
1975
- 1975-06-11 JP JP6969475A patent/JPS51145988A/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53111578A (en) * | 1977-03-10 | 1978-09-29 | Hitachi Ltd | Filter type dust collector |
| JPS6179562A (ja) * | 1984-09-26 | 1986-04-23 | Hirabayashi:Kk | 切断機の加重伝達装置 |
| JPH04122566A (ja) * | 1989-12-22 | 1992-04-23 | Wacker Chemitronic Ges Elektron Grundstoffe Mbh | バーまたはブロック状加工材からのウェファー切断用ワイヤーソー |
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