JPS51146183A - High frequency wave ion plating device - Google Patents

High frequency wave ion plating device

Info

Publication number
JPS51146183A
JPS51146183A JP50069734A JP6973475A JPS51146183A JP S51146183 A JPS51146183 A JP S51146183A JP 50069734 A JP50069734 A JP 50069734A JP 6973475 A JP6973475 A JP 6973475A JP S51146183 A JPS51146183 A JP S51146183A
Authority
JP
Japan
Prior art keywords
high frequency
frequency wave
ion plating
plating device
wave ion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50069734A
Other languages
Japanese (ja)
Other versions
JPS5440235B2 (en
Inventor
Hisao Yamaguchi
Muneharu Komiya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulvac Inc
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Priority to JP50069734A priority Critical patent/JPS51146183A/en
Publication of JPS51146183A publication Critical patent/JPS51146183A/en
Publication of JPS5440235B2 publication Critical patent/JPS5440235B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

PURPOSE: A high frequency wave ion plating device, that establishes enabling to change relative degree between electronic bombard and ion bombard at one cycle of high frequency wave by appling direct current electro-field capable of controlling high frequency wave electro-field.
COPYRIGHT: (C)1976,JPO&Japio
JP50069734A 1975-06-11 1975-06-11 High frequency wave ion plating device Granted JPS51146183A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50069734A JPS51146183A (en) 1975-06-11 1975-06-11 High frequency wave ion plating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50069734A JPS51146183A (en) 1975-06-11 1975-06-11 High frequency wave ion plating device

Publications (2)

Publication Number Publication Date
JPS51146183A true JPS51146183A (en) 1976-12-15
JPS5440235B2 JPS5440235B2 (en) 1979-12-03

Family

ID=13411332

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50069734A Granted JPS51146183A (en) 1975-06-11 1975-06-11 High frequency wave ion plating device

Country Status (1)

Country Link
JP (1) JPS51146183A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53100179A (en) * 1977-02-14 1978-09-01 Nippon Musical Instruments Mfg Activationnreactive evaporation method
JPS63297552A (en) * 1987-05-29 1988-12-05 Nissin Electric Co Ltd Film forming device
JP2002220657A (en) * 2001-01-25 2002-08-09 Kiyousera Opt Kk Thin film forming apparatus and thin film forming method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53100179A (en) * 1977-02-14 1978-09-01 Nippon Musical Instruments Mfg Activationnreactive evaporation method
JPS63297552A (en) * 1987-05-29 1988-12-05 Nissin Electric Co Ltd Film forming device
JP2002220657A (en) * 2001-01-25 2002-08-09 Kiyousera Opt Kk Thin film forming apparatus and thin film forming method

Also Published As

Publication number Publication date
JPS5440235B2 (en) 1979-12-03

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