JPS51146350A - Ultrasonic wire bonding device - Google Patents

Ultrasonic wire bonding device

Info

Publication number
JPS51146350A
JPS51146350A JP50069667A JP6966775A JPS51146350A JP S51146350 A JPS51146350 A JP S51146350A JP 50069667 A JP50069667 A JP 50069667A JP 6966775 A JP6966775 A JP 6966775A JP S51146350 A JPS51146350 A JP S51146350A
Authority
JP
Japan
Prior art keywords
wire bonding
bonding device
ultrasonic wire
ultrasonic
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50069667A
Other languages
Japanese (ja)
Inventor
Tasao Soga
Tomirou Yasuda
Mamoru Sawahata
Shiyouji Sasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50069667A priority Critical patent/JPS51146350A/en
Publication of JPS51146350A publication Critical patent/JPS51146350A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

Landscapes

  • Pressure Welding/Diffusion-Bonding (AREA)
  • Wire Bonding (AREA)
JP50069667A 1975-06-11 1975-06-11 Ultrasonic wire bonding device Pending JPS51146350A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50069667A JPS51146350A (en) 1975-06-11 1975-06-11 Ultrasonic wire bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50069667A JPS51146350A (en) 1975-06-11 1975-06-11 Ultrasonic wire bonding device

Publications (1)

Publication Number Publication Date
JPS51146350A true JPS51146350A (en) 1976-12-15

Family

ID=13409403

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50069667A Pending JPS51146350A (en) 1975-06-11 1975-06-11 Ultrasonic wire bonding device

Country Status (1)

Country Link
JP (1) JPS51146350A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55120145A (en) * 1979-03-12 1980-09-16 Chiyou Lsi Gijutsu Kenkyu Kumiai Bonding apparatus
JPS55132049A (en) * 1979-03-30 1980-10-14 Nec Corp Method and device for wire bonding
JPS57135736U (en) * 1981-02-20 1982-08-24
JPS57211743A (en) * 1981-06-24 1982-12-25 Nec Home Electronics Ltd Wire bonding method for semiconductor device
JPS58139A (en) * 1981-06-25 1983-01-05 Nec Corp Manufacture of semiconductor device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55120145A (en) * 1979-03-12 1980-09-16 Chiyou Lsi Gijutsu Kenkyu Kumiai Bonding apparatus
JPS55132049A (en) * 1979-03-30 1980-10-14 Nec Corp Method and device for wire bonding
JPS57135736U (en) * 1981-02-20 1982-08-24
JPS57211743A (en) * 1981-06-24 1982-12-25 Nec Home Electronics Ltd Wire bonding method for semiconductor device
JPS58139A (en) * 1981-06-25 1983-01-05 Nec Corp Manufacture of semiconductor device

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