JPS51147962A - Method of mounting semiconductor devices - Google Patents
Method of mounting semiconductor devicesInfo
- Publication number
- JPS51147962A JPS51147962A JP6545075A JP6545075A JPS51147962A JP S51147962 A JPS51147962 A JP S51147962A JP 6545075 A JP6545075 A JP 6545075A JP 6545075 A JP6545075 A JP 6545075A JP S51147962 A JPS51147962 A JP S51147962A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor devices
- mounting semiconductor
- mounting
- devices
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6545075A JPS51147962A (en) | 1975-06-02 | 1975-06-02 | Method of mounting semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6545075A JPS51147962A (en) | 1975-06-02 | 1975-06-02 | Method of mounting semiconductor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS51147962A true JPS51147962A (en) | 1976-12-18 |
Family
ID=13287479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6545075A Pending JPS51147962A (en) | 1975-06-02 | 1975-06-02 | Method of mounting semiconductor devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS51147962A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59210645A (en) * | 1984-04-27 | 1984-11-29 | Hitachi Ltd | Manufacture of resin sealed semiconductor device |
| JPS621236A (en) * | 1986-04-11 | 1987-01-07 | Hitachi Ltd | Manufacture of semiconductor device |
| JPS63226046A (en) * | 1986-12-19 | 1988-09-20 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Manufacture of semiconductor device with reduced packaging stress |
-
1975
- 1975-06-02 JP JP6545075A patent/JPS51147962A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59210645A (en) * | 1984-04-27 | 1984-11-29 | Hitachi Ltd | Manufacture of resin sealed semiconductor device |
| JPS621236A (en) * | 1986-04-11 | 1987-01-07 | Hitachi Ltd | Manufacture of semiconductor device |
| JPS63226046A (en) * | 1986-12-19 | 1988-09-20 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Manufacture of semiconductor device with reduced packaging stress |
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