JPS51150671A - Method of fixing electronic parts - Google Patents

Method of fixing electronic parts

Info

Publication number
JPS51150671A
JPS51150671A JP50075271A JP7527175A JPS51150671A JP S51150671 A JPS51150671 A JP S51150671A JP 50075271 A JP50075271 A JP 50075271A JP 7527175 A JP7527175 A JP 7527175A JP S51150671 A JPS51150671 A JP S51150671A
Authority
JP
Japan
Prior art keywords
electronic parts
fixing electronic
fixing
parts
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50075271A
Other languages
Japanese (ja)
Other versions
JPS5928996B2 (en
Inventor
Yukihiro Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP50075271A priority Critical patent/JPS5928996B2/en
Publication of JPS51150671A publication Critical patent/JPS51150671A/en
Publication of JPS5928996B2 publication Critical patent/JPS5928996B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
JP50075271A 1975-06-19 1975-06-19 How to install electronic parts Expired JPS5928996B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50075271A JPS5928996B2 (en) 1975-06-19 1975-06-19 How to install electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50075271A JPS5928996B2 (en) 1975-06-19 1975-06-19 How to install electronic parts

Publications (2)

Publication Number Publication Date
JPS51150671A true JPS51150671A (en) 1976-12-24
JPS5928996B2 JPS5928996B2 (en) 1984-07-17

Family

ID=13571388

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50075271A Expired JPS5928996B2 (en) 1975-06-19 1975-06-19 How to install electronic parts

Country Status (1)

Country Link
JP (1) JPS5928996B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55138897A (en) * 1979-04-17 1980-10-30 Matsushita Electric Industrial Co Ltd Device for mounting leadless component to printed circuit board
JPS59117188A (en) * 1982-12-24 1984-07-06 株式会社日立製作所 Method of constructing circuit board
JPH0237735A (en) * 1988-07-27 1990-02-07 Semiconductor Energy Lab Co Ltd Mounting structure of semiconductor chip
WO1997003460A1 (en) * 1995-07-12 1997-01-30 Hoya Corporation Bare chip mounted board, method of manufacturing the board, and method of forming electrode of bare chip

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4857652U (en) * 1971-11-02 1973-07-23

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4857652U (en) * 1971-11-02 1973-07-23

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55138897A (en) * 1979-04-17 1980-10-30 Matsushita Electric Industrial Co Ltd Device for mounting leadless component to printed circuit board
JPS59117188A (en) * 1982-12-24 1984-07-06 株式会社日立製作所 Method of constructing circuit board
JPH0237735A (en) * 1988-07-27 1990-02-07 Semiconductor Energy Lab Co Ltd Mounting structure of semiconductor chip
WO1997003460A1 (en) * 1995-07-12 1997-01-30 Hoya Corporation Bare chip mounted board, method of manufacturing the board, and method of forming electrode of bare chip

Also Published As

Publication number Publication date
JPS5928996B2 (en) 1984-07-17

Similar Documents

Publication Publication Date Title
JPS5248983A (en) Method of producing electronic device
JPS5278243A (en) Method of coating electric parts or electronic parts
JPS5280397A (en) Popymerization method of epsilonncaprolactam
JPS51150671A (en) Method of fixing electronic parts
JPS51150672A (en) Method of fixing electronic parts
JPS5216664A (en) Method of fixing integrated circuit modules
JPS527913A (en) Method of fixing acetoaldehyde
JPS52155357A (en) Method of making electronic parts
JPS5265912A (en) Method of fixing stud
JPS5235862A (en) Method of coating electronic parts
JPS51132454A (en) Method of mounting electronic parts with leads
JPS5221672A (en) Method of mounting electronic parts
JPS523160A (en) Method of connecting electronic circuits
JPS51121177A (en) Method of packing electronic parts
JPS5376355A (en) Method of making electronic parts
JPS51119970A (en) Method of connecting leadless electronic parts
JPS52104756A (en) Method of temporarily fixing electronic parts
JPS51136174A (en) Method of releasing electronic parts from hold
JPS528465A (en) Sheathing of electronic parts
JPS523155A (en) Sheathing of electronic parts
JPS51133371A (en) Method of fixing two members
JPS5279267A (en) Method of mounting electronic element
JPS5235863A (en) Method of coating electronic parts
JPS5224962A (en) Method of colddrolling
JPS5221675A (en) Method of connecting electronic parts