JPS51150974A - Manufacture process for a semiconductor device - Google Patents

Manufacture process for a semiconductor device

Info

Publication number
JPS51150974A
JPS51150974A JP50074906A JP7490675A JPS51150974A JP S51150974 A JPS51150974 A JP S51150974A JP 50074906 A JP50074906 A JP 50074906A JP 7490675 A JP7490675 A JP 7490675A JP S51150974 A JPS51150974 A JP S51150974A
Authority
JP
Japan
Prior art keywords
semiconductor device
manufacture process
comporatively
divice
make
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50074906A
Other languages
Japanese (ja)
Inventor
Koichi Nakagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP50074906A priority Critical patent/JPS51150974A/en
Publication of JPS51150974A publication Critical patent/JPS51150974A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To make a high reliable semi conductor divice which has a simple mechanism comporatively.
COPYRIGHT: (C)1976,JPO&Japio
JP50074906A 1975-06-19 1975-06-19 Manufacture process for a semiconductor device Pending JPS51150974A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50074906A JPS51150974A (en) 1975-06-19 1975-06-19 Manufacture process for a semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50074906A JPS51150974A (en) 1975-06-19 1975-06-19 Manufacture process for a semiconductor device

Publications (1)

Publication Number Publication Date
JPS51150974A true JPS51150974A (en) 1976-12-24

Family

ID=13560889

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50074906A Pending JPS51150974A (en) 1975-06-19 1975-06-19 Manufacture process for a semiconductor device

Country Status (1)

Country Link
JP (1) JPS51150974A (en)

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