JPS5121839B2 - - Google Patents
Info
- Publication number
- JPS5121839B2 JPS5121839B2 JP48035623A JP3562373A JPS5121839B2 JP S5121839 B2 JPS5121839 B2 JP S5121839B2 JP 48035623 A JP48035623 A JP 48035623A JP 3562373 A JP3562373 A JP 3562373A JP S5121839 B2 JPS5121839 B2 JP S5121839B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48035623A JPS5121839B2 (en) | 1973-03-30 | 1973-03-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48035623A JPS5121839B2 (en) | 1973-03-30 | 1973-03-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS49122598A JPS49122598A (en) | 1974-11-22 |
| JPS5121839B2 true JPS5121839B2 (en) | 1976-07-05 |
Family
ID=12446975
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP48035623A Expired JPS5121839B2 (en) | 1973-03-30 | 1973-03-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5121839B2 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5827716A (en) * | 1981-08-11 | 1983-02-18 | Asahi Chem Ind Co Ltd | Curing agent composition for aqueous dispersion of epoxy resin |
| JPS58145725A (en) * | 1982-02-25 | 1983-08-30 | Sumitomo Bakelite Co Ltd | Heat-resistant epoxy resin composition |
| JPS58198525A (en) * | 1982-05-14 | 1983-11-18 | Sanyurejin Kk | Epoxy resin composition |
| JPS6053526A (en) * | 1983-09-02 | 1985-03-27 | Hitachi Chem Co Ltd | Epoxy resin composition for sealing semiconductor |
| JPS60190418A (en) * | 1984-03-12 | 1985-09-27 | Mitsubishi Electric Corp | Liquid epoxy resin composition for sealing semiconductors |
| JP4961691B2 (en) * | 2005-07-25 | 2012-06-27 | 株式会社明電舎 | Insulated polymer material cured product |
| WO2007075769A1 (en) * | 2005-12-22 | 2007-07-05 | Dow Global Technologies Inc. | A curable epoxy resin composition and laminates made therefrom |
-
1973
- 1973-03-30 JP JP48035623A patent/JPS5121839B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS49122598A (en) | 1974-11-22 |