JPS512382A - - Google Patents
Info
- Publication number
- JPS512382A JPS512382A JP49071313A JP7131374A JPS512382A JP S512382 A JPS512382 A JP S512382A JP 49071313 A JP49071313 A JP 49071313A JP 7131374 A JP7131374 A JP 7131374A JP S512382 A JPS512382 A JP S512382A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49071313A JPS512382A (ja) | 1974-06-24 | 1974-06-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49071313A JPS512382A (ja) | 1974-06-24 | 1974-06-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS512382A true JPS512382A (ja) | 1976-01-09 |
Family
ID=13456984
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP49071313A Pending JPS512382A (ja) | 1974-06-24 | 1974-06-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS512382A (ja) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02185053A (ja) * | 1989-01-12 | 1990-07-19 | Shinko Electric Ind Co Ltd | フリップチップボンディング用基板 |
| US5447886A (en) * | 1993-02-18 | 1995-09-05 | Sharp Kabushiki Kaisha | Method for mounting semiconductor chip on circuit board |
| JP2004031474A (ja) * | 2002-06-24 | 2004-01-29 | Tdk Corp | 電子部品及びその製造方法 |
-
1974
- 1974-06-24 JP JP49071313A patent/JPS512382A/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02185053A (ja) * | 1989-01-12 | 1990-07-19 | Shinko Electric Ind Co Ltd | フリップチップボンディング用基板 |
| US5447886A (en) * | 1993-02-18 | 1995-09-05 | Sharp Kabushiki Kaisha | Method for mounting semiconductor chip on circuit board |
| JP2004031474A (ja) * | 2002-06-24 | 2004-01-29 | Tdk Corp | 電子部品及びその製造方法 |