JPS5127464A - HORIIMIDOKEIJUSHIMAKUNO SENTAKUTEKIETSUCHINGUHOHO - Google Patents

HORIIMIDOKEIJUSHIMAKUNO SENTAKUTEKIETSUCHINGUHOHO

Info

Publication number
JPS5127464A
JPS5127464A JP9615774A JP9615774A JPS5127464A JP S5127464 A JPS5127464 A JP S5127464A JP 9615774 A JP9615774 A JP 9615774A JP 9615774 A JP9615774 A JP 9615774A JP S5127464 A JPS5127464 A JP S5127464A
Authority
JP
Japan
Prior art keywords
sentakutekietsuchinguhoho
horiimidokeijushimakuno
horiimidokeijushimakuno sentakutekietsuchinguhoho
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9615774A
Other languages
Japanese (ja)
Other versions
JPS5542497B2 (en
Inventor
Atsushi Saiki
Toshio Ookubo
Tadayoshi Harada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9615774A priority Critical patent/JPS5127464A/en
Publication of JPS5127464A publication Critical patent/JPS5127464A/en
Priority to US05/695,040 priority patent/US4113550A/en
Priority to US05/924,008 priority patent/US4218283A/en
Publication of JPS5542497B2 publication Critical patent/JPS5542497B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Weting (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
JP9615774A 1974-08-23 1974-08-23 HORIIMIDOKEIJUSHIMAKUNO SENTAKUTEKIETSUCHINGUHOHO Granted JPS5127464A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP9615774A JPS5127464A (en) 1974-08-23 1974-08-23 HORIIMIDOKEIJUSHIMAKUNO SENTAKUTEKIETSUCHINGUHOHO
US05/695,040 US4113550A (en) 1974-08-23 1976-06-11 Method for fabricating semiconductor device and etchant for polymer resin
US05/924,008 US4218283A (en) 1974-08-23 1978-07-12 Method for fabricating semiconductor device and etchant for polymer resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9615774A JPS5127464A (en) 1974-08-23 1974-08-23 HORIIMIDOKEIJUSHIMAKUNO SENTAKUTEKIETSUCHINGUHOHO

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP6142579A Division JPS55780A (en) 1979-05-21 1979-05-21 Etching solution for high polymer resin

Publications (2)

Publication Number Publication Date
JPS5127464A true JPS5127464A (en) 1976-03-08
JPS5542497B2 JPS5542497B2 (en) 1980-10-31

Family

ID=14157512

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9615774A Granted JPS5127464A (en) 1974-08-23 1974-08-23 HORIIMIDOKEIJUSHIMAKUNO SENTAKUTEKIETSUCHINGUHOHO

Country Status (1)

Country Link
JP (1) JPS5127464A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52141592A (en) * 1976-05-20 1977-11-25 Fujitsu Ltd Process of semiconductor device
JPS55150231A (en) * 1979-05-14 1980-11-22 Hitachi Ltd Opening method of insulating film
JPS5660032A (en) * 1979-10-19 1981-05-23 Toshiba Corp Manufacture of semiconductor device
JPS5944830A (en) * 1982-08-02 1984-03-13 フエアチアイルド・カメラ・アンド・インストルメント・コ−ポレ−シヨン Method of bonding, coupling and destroying lift-off region on semiconductor structure

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5843089U (en) * 1981-09-18 1983-03-23 フオスタ−電機株式会社 speaker

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52141592A (en) * 1976-05-20 1977-11-25 Fujitsu Ltd Process of semiconductor device
JPS55150231A (en) * 1979-05-14 1980-11-22 Hitachi Ltd Opening method of insulating film
JPS5660032A (en) * 1979-10-19 1981-05-23 Toshiba Corp Manufacture of semiconductor device
JPS5944830A (en) * 1982-08-02 1984-03-13 フエアチアイルド・カメラ・アンド・インストルメント・コ−ポレ−シヨン Method of bonding, coupling and destroying lift-off region on semiconductor structure

Also Published As

Publication number Publication date
JPS5542497B2 (en) 1980-10-31

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