JPS5132275A - - Google Patents
Info
- Publication number
- JPS5132275A JPS5132275A JP49104987A JP10498774A JPS5132275A JP S5132275 A JPS5132275 A JP S5132275A JP 49104987 A JP49104987 A JP 49104987A JP 10498774 A JP10498774 A JP 10498774A JP S5132275 A JPS5132275 A JP S5132275A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49104987A JPS5132275A (2) | 1974-09-13 | 1974-09-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49104987A JPS5132275A (2) | 1974-09-13 | 1974-09-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5132275A true JPS5132275A (2) | 1976-03-18 |
Family
ID=14395429
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP49104987A Pending JPS5132275A (2) | 1974-09-13 | 1974-09-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5132275A (2) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62291934A (ja) * | 1986-06-12 | 1987-12-18 | Alps Electric Co Ltd | フリツプチツプの実装方法 |
| JPH0360138A (ja) * | 1989-07-28 | 1991-03-15 | Nec Kansai Ltd | ボンディング方法 |
| JP2016503235A (ja) * | 2012-12-18 | 2016-02-01 | ネーデルランセ オルハニサチエ フォール トゥーヘパスト−ナツールウェーテンシャッペルック オンデルズク テーエヌオーＮｅｄｅｒｌａｎｄｓｅ Ｏｒｇａｎｉｓａｔｉｅ ｖｏｏｒ ｔｏｅｇｅｐａｓｔ−ｎａｔｕｕｒｗｅｔｅｎｓｃｈａｐｐｅｌｉｊｋ ｏｎｄｅｒｚｏｅｋ ＴＮＯ | 組み込まれた硬化ゾーン中の熱硬化性材料を硬化させること |
-
1974
- 1974-09-13 JP JP49104987A patent/JPS5132275A/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62291934A (ja) * | 1986-06-12 | 1987-12-18 | Alps Electric Co Ltd | フリツプチツプの実装方法 |
| JPH0360138A (ja) * | 1989-07-28 | 1991-03-15 | Nec Kansai Ltd | ボンディング方法 |
| JP2016503235A (ja) * | 2012-12-18 | 2016-02-01 | ネーデルランセ オルハニサチエ フォール トゥーヘパスト−ナツールウェーテンシャッペルック オンデルズク テーエヌオーＮｅｄｅｒｌａｎｄｓｅ Ｏｒｇａｎｉｓａｔｉｅ ｖｏｏｒ ｔｏｅｇｅｐａｓｔ−ｎａｔｕｕｒｗｅｔｅｎｓｃｈａｐｐｅｌｉｊｋ ｏｎｄｅｒｚｏｅｋ ＴＮＯ | 組み込まれた硬化ゾーン中の熱硬化性材料を硬化させること |