JPS5143564U - - Google Patents
Info
- Publication number
- JPS5143564U JPS5143564U JP1974116171U JP11617174U JPS5143564U JP S5143564 U JPS5143564 U JP S5143564U JP 1974116171 U JP1974116171 U JP 1974116171U JP 11617174 U JP11617174 U JP 11617174U JP S5143564 U JPS5143564 U JP S5143564U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1974116171U JPS5413010Y2 (de) | 1974-09-25 | 1974-09-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1974116171U JPS5413010Y2 (de) | 1974-09-25 | 1974-09-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5143564U true JPS5143564U (de) | 1976-03-31 |
| JPS5413010Y2 JPS5413010Y2 (de) | 1979-06-05 |
Family
ID=28349715
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1974116171U Expired JPS5413010Y2 (de) | 1974-09-25 | 1974-09-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5413010Y2 (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60163447A (ja) * | 1984-01-17 | 1985-08-26 | ローベルト・ボツシユ・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング | 半導体素子 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4828292U (de) * | 1971-08-05 | 1973-04-06 |
-
1974
- 1974-09-25 JP JP1974116171U patent/JPS5413010Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4828292U (de) * | 1971-08-05 | 1973-04-06 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60163447A (ja) * | 1984-01-17 | 1985-08-26 | ローベルト・ボツシユ・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング | 半導体素子 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5413010Y2 (de) | 1979-06-05 |