JPS514628B1 - - Google Patents
Info
- Publication number
- JPS514628B1 JPS514628B1 JP1012470A JP1012470A JPS514628B1 JP S514628 B1 JPS514628 B1 JP S514628B1 JP 1012470 A JP1012470 A JP 1012470A JP 1012470 A JP1012470 A JP 1012470A JP S514628 B1 JPS514628 B1 JP S514628B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Wire Bonding (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1012470A JPS514628B1 (de) | 1970-02-05 | 1970-02-05 | |
| US00111912A US3771219A (en) | 1970-02-05 | 1971-02-02 | Method for manufacturing semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1012470A JPS514628B1 (de) | 1970-02-05 | 1970-02-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS514628B1 true JPS514628B1 (de) | 1976-02-13 |
Family
ID=11741530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1012470A Pending JPS514628B1 (de) | 1970-02-05 | 1970-02-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS514628B1 (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003511869A (ja) * | 1999-10-08 | 2003-03-25 | プレットナー アンドレアス | 非接触チップカードの製造方法及び接触素子を有するチップからなる電気ユニットの製造方法 |
-
1970
- 1970-02-05 JP JP1012470A patent/JPS514628B1/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003511869A (ja) * | 1999-10-08 | 2003-03-25 | プレットナー アンドレアス | 非接触チップカードの製造方法及び接触素子を有するチップからなる電気ユニットの製造方法 |