JPS5146350A - SEIKEIYOKYOKAHORIAMIDOJUSHISOSEIBUTSUNO SEIZOHOHO - Google Patents
SEIKEIYOKYOKAHORIAMIDOJUSHISOSEIBUTSUNO SEIZOHOHOInfo
- Publication number
- JPS5146350A JPS5146350A JP11867974A JP11867974A JPS5146350A JP S5146350 A JPS5146350 A JP S5146350A JP 11867974 A JP11867974 A JP 11867974A JP 11867974 A JP11867974 A JP 11867974A JP S5146350 A JPS5146350 A JP S5146350A
- Authority
- JP
- Japan
- Prior art keywords
- seikeiyokyokahoriamidojushisoseibutsuno
- seizohoho
- seikeiyokyokahoriamidojushisoseibutsuno seizohoho
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11867974A JPS5146350A (en) | 1974-10-17 | 1974-10-17 | SEIKEIYOKYOKAHORIAMIDOJUSHISOSEIBUTSUNO SEIZOHOHO |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11867974A JPS5146350A (en) | 1974-10-17 | 1974-10-17 | SEIKEIYOKYOKAHORIAMIDOJUSHISOSEIBUTSUNO SEIZOHOHO |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5146350A true JPS5146350A (en) | 1976-04-20 |
Family
ID=14742511
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11867974A Pending JPS5146350A (en) | 1974-10-17 | 1974-10-17 | SEIKEIYOKYOKAHORIAMIDOJUSHISOSEIBUTSUNO SEIZOHOHO |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5146350A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006297701A (en) * | 2005-04-19 | 2006-11-02 | Hitachi Chem Co Ltd | Manufacturing method of epoxy resin composition for semiconductor encapsulation, epoxy resin composition for semiconductor encapsulation, and electronic component device using the same |
| WO2013069782A1 (en) * | 2011-11-11 | 2013-05-16 | 住友化学株式会社 | Method for producing thermoplastic resin composition, and molded article |
| CN103889672A (en) * | 2011-10-25 | 2014-06-25 | 罗地亚经营管理公司 | Process for the preparation of polyamide particles |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50119097A (en) * | 1974-03-05 | 1975-09-18 |
-
1974
- 1974-10-17 JP JP11867974A patent/JPS5146350A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50119097A (en) * | 1974-03-05 | 1975-09-18 |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006297701A (en) * | 2005-04-19 | 2006-11-02 | Hitachi Chem Co Ltd | Manufacturing method of epoxy resin composition for semiconductor encapsulation, epoxy resin composition for semiconductor encapsulation, and electronic component device using the same |
| CN103889672A (en) * | 2011-10-25 | 2014-06-25 | 罗地亚经营管理公司 | Process for the preparation of polyamide particles |
| JP2014530782A (en) * | 2011-10-25 | 2014-11-20 | ロディア オペレーションズRhodia Operations | Preparation method of polyamide granules |
| US9656409B2 (en) | 2011-10-25 | 2017-05-23 | Rhodia Operations | Method for preparing polyamide granules |
| CN110561642A (en) * | 2011-10-25 | 2019-12-13 | 罗地亚经营管理公司 | Process for preparing polyamide granules |
| WO2013069782A1 (en) * | 2011-11-11 | 2013-05-16 | 住友化学株式会社 | Method for producing thermoplastic resin composition, and molded article |
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