JPS5163952U - - Google Patents
Info
- Publication number
- JPS5163952U JPS5163952U JP1974138344U JP13834474U JPS5163952U JP S5163952 U JPS5163952 U JP S5163952U JP 1974138344 U JP1974138344 U JP 1974138344U JP 13834474 U JP13834474 U JP 13834474U JP S5163952 U JPS5163952 U JP S5163952U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Casings For Electric Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1974138344U JPS5163952U (mo) | 1974-11-14 | 1974-11-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1974138344U JPS5163952U (mo) | 1974-11-14 | 1974-11-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5163952U true JPS5163952U (mo) | 1976-05-20 |
Family
ID=28412214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1974138344U Pending JPS5163952U (mo) | 1974-11-14 | 1974-11-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5163952U (mo) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5263364U (mo) * | 1975-11-05 | 1977-05-10 | ||
| JPS59171360U (ja) * | 1983-04-28 | 1984-11-16 | 三洋電機株式会社 | 自動插入用発光ダイオ−ドランプ |
-
1974
- 1974-11-14 JP JP1974138344U patent/JPS5163952U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5263364U (mo) * | 1975-11-05 | 1977-05-10 | ||
| JPS59171360U (ja) * | 1983-04-28 | 1984-11-16 | 三洋電機株式会社 | 自動插入用発光ダイオ−ドランプ |