JPS516473A - - Google Patents
Info
- Publication number
- JPS516473A JPS516473A JP49076385A JP7638574A JPS516473A JP S516473 A JPS516473 A JP S516473A JP 49076385 A JP49076385 A JP 49076385A JP 7638574 A JP7638574 A JP 7638574A JP S516473 A JPS516473 A JP S516473A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49076385A JPS5224388B2 (2) | 1974-07-05 | 1974-07-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49076385A JPS5224388B2 (2) | 1974-07-05 | 1974-07-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS516473A true JPS516473A (2) | 1976-01-20 |
| JPS5224388B2 JPS5224388B2 (2) | 1977-06-30 |
Family
ID=13603855
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP49076385A Expired JPS5224388B2 (2) | 1974-07-05 | 1974-07-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5224388B2 (2) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5532770U (2) * | 1978-08-25 | 1980-03-03 | ||
| JPS5748648U (2) * | 1980-09-02 | 1982-03-18 | ||
| JPH0738039A (ja) * | 1993-07-19 | 1995-02-07 | Nec Corp | 垂直型表面実装半導体パッケージ |
| JP2014143373A (ja) * | 2013-01-25 | 2014-08-07 | Mitsubishi Electric Corp | 半導体装置および半導体装置の製造方法 |
-
1974
- 1974-07-05 JP JP49076385A patent/JPS5224388B2/ja not_active Expired
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5532770U (2) * | 1978-08-25 | 1980-03-03 | ||
| JPS5748648U (2) * | 1980-09-02 | 1982-03-18 | ||
| JPH0738039A (ja) * | 1993-07-19 | 1995-02-07 | Nec Corp | 垂直型表面実装半導体パッケージ |
| JP2014143373A (ja) * | 2013-01-25 | 2014-08-07 | Mitsubishi Electric Corp | 半導体装置および半導体装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5224388B2 (2) | 1977-06-30 |