JPS516505B1 - - Google Patents

Info

Publication number: JPS516505B1
Authority: JP; Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP46045785A

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1970-07-15

Filing date

1971-06-25

Publication date

1976-02-28

1971-06-25 Application filed filed Critical

1976-02-28 Publication of JPS516505B1 publication Critical patent/JPS516505B1/ja

Status Pending legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W44/00—Electrical arrangements for controlling or matching impedance
- H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W44/00—Electrical arrangements for controlling or matching impedance
- H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
- H10W44/226—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for HF amplifiers
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings

JP46045785A 1970-07-15 1971-06-25 Pending JPS516505B1 (ja)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US5513270A	1970-07-15	1970-07-15

Publications (1)

Publication Number	Publication Date
JPS516505B1 true JPS516505B1 (ja)	1976-02-28

Family

ID=21995832

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP46045785A Pending JPS516505B1 (ja)	1970-07-15	1971-06-25

Country Status (3)

Country	Link
US (1)	US3649872A (ja)
JP (1)	JPS516505B1 (ja)
FR (1)	FR2098405A1 (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3784883A (en) *	1971-07-19	1974-01-08	Communications Transistor Corp	Transistor package
US3740672A (en) *	1971-11-22	1973-06-19	Rca Corp	Semiconductor carrier for microwave applications
US3733525A (en) *	1972-03-20	1973-05-15	Collins Radio Co	Rf microwave amplifier and carrier
US3801938A (en) *	1972-05-31	1974-04-02	Trw Inc	Package for microwave semiconductor device
US4242598A (en) *	1974-10-02	1980-12-30	Varian Associates, Inc.	Temperature compensating transistor bias device
US4266089A (en) *	1978-09-14	1981-05-05	Isotronics, Incorporated	All metal flat package having excellent heat transfer characteristics
US4538168A (en) *	1981-09-30	1985-08-27	Unitrode Corporation	High power semiconductor package
US5764484A (en) *	1996-11-15	1998-06-09	Olin Corporation	Ground ring for a metal electronic package
US5889319A (en) *	1996-07-19	1999-03-30	Ericsson, Inc.	RF power package with a dual ground
EP1805800A2 (en) *	2004-09-28	2007-07-11	Intraglobal Corporation	Method for micropackaging of electrical or electromechanical devices and micropackage
US7690106B2 (en)	2006-10-25	2010-04-06	Texas Instruments Incorporated	Ceramic header method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3515952A (en) *	1965-02-17	1970-06-02	Motorola Inc	Mounting structure for high power transistors
US3387190A (en) *	1965-08-19	1968-06-04	Itt	High frequency power transistor having electrodes forming transmission lines
US3479570A (en) *	1966-06-14	1969-11-18	Rca Corp	Encapsulation and connection structure for high power and high frequency semiconductor devices
US3489956A (en) *	1966-09-30	1970-01-13	Nippon Electric Co	Semiconductor device container
US3554821A (en) *	1967-07-17	1971-01-12	Rca Corp	Process for manufacturing microminiature electrical component mounting assemblies
NL6717634A (ja) *	1967-12-22	1969-06-24

1970
- 1970-07-15 US US55132A patent/US3649872A/en not_active Expired - Lifetime
1971
- 1971-05-27 FR FR7119297A patent/FR2098405A1/fr not_active Withdrawn
- 1971-06-25 JP JP46045785A patent/JPS516505B1/ja active Pending

Also Published As

Publication number	Publication date
FR2098405A1 (ja)	1972-03-10
US3649872A (en)	1972-03-14

Publication	Publication Date	Title
JPS4942427B1 (ja)	1974-11-14
JPS522791B1 (ja)	1977-01-24
ATA96471A (ja)	1973-02-15
AU2044470A (ja)	1972-03-30
AU1473870A (ja)	1971-11-11
AU1716970A (ja)	1972-01-06
AU1326870A (ja)	1971-10-28
AU2017870A (ja)	1972-03-23
AU2085370A (ja)	1972-04-13
AU1517670A (ja)	1971-11-18
AU1833270A (ja)	1972-02-10
AR195465A1 (ja)	1973-10-15
AU1581370A (ja)	1971-12-09
AU1969370A (ja)	1972-03-16
AU2119370A (ja)	1972-04-20
AU2061170A (ja)	1972-04-13
AU1343870A (ja)	1971-10-07
AU1235770A (ja)	1971-09-16
AU1328670A (ja)	1971-10-07
AU1277070A (ja)	1971-09-23
AU2130770A (ja)	1972-04-27
AU1881070A (ja)	1972-02-17
AU1247570A (ja)	1971-09-16
AU1689770A (ja)	1972-01-06
AU1603270A (ja)	1971-12-09