JPS5165566A - - Google Patents
Info
- Publication number
- JPS5165566A JPS5165566A JP49138371A JP13837174A JPS5165566A JP S5165566 A JPS5165566 A JP S5165566A JP 49138371 A JP49138371 A JP 49138371A JP 13837174 A JP13837174 A JP 13837174A JP S5165566 A JPS5165566 A JP S5165566A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49138371A JPS5165566A (en) | 1974-12-04 | 1974-12-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49138371A JPS5165566A (en) | 1974-12-04 | 1974-12-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5165566A true JPS5165566A (en) | 1976-06-07 |
Family
ID=15220360
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP49138371A Pending JPS5165566A (en) | 1974-12-04 | 1974-12-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5165566A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61123162A (en) * | 1984-11-20 | 1986-06-11 | Toshiba Corp | Lead frame for resin seal type semiconductor device |
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1974
- 1974-12-04 JP JP49138371A patent/JPS5165566A/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61123162A (en) * | 1984-11-20 | 1986-06-11 | Toshiba Corp | Lead frame for resin seal type semiconductor device |