JPS5165880A - Handotaisochino kumitatehoho - Google Patents

Handotaisochino kumitatehoho

Info

Publication number
JPS5165880A
JPS5165880A JP49139771A JP13977174A JPS5165880A JP S5165880 A JPS5165880 A JP S5165880A JP 49139771 A JP49139771 A JP 49139771A JP 13977174 A JP13977174 A JP 13977174A JP S5165880 A JPS5165880 A JP S5165880A
Authority
JP
Japan
Prior art keywords
kumitatehoho
handotaisochino
handotaisochino kumitatehoho
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP49139771A
Other languages
Japanese (ja)
Other versions
JPS5714025B2 (en
Inventor
Katsuki Iwasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP49139771A priority Critical patent/JPS5165880A/en
Publication of JPS5165880A publication Critical patent/JPS5165880A/en
Publication of JPS5714025B2 publication Critical patent/JPS5714025B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP49139771A 1974-12-04 1974-12-04 Handotaisochino kumitatehoho Granted JPS5165880A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP49139771A JPS5165880A (en) 1974-12-04 1974-12-04 Handotaisochino kumitatehoho

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP49139771A JPS5165880A (en) 1974-12-04 1974-12-04 Handotaisochino kumitatehoho

Publications (2)

Publication Number Publication Date
JPS5165880A true JPS5165880A (en) 1976-06-07
JPS5714025B2 JPS5714025B2 (en) 1982-03-20

Family

ID=15253011

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49139771A Granted JPS5165880A (en) 1974-12-04 1974-12-04 Handotaisochino kumitatehoho

Country Status (1)

Country Link
JP (1) JPS5165880A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53152565U (en) * 1977-05-06 1978-12-01

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04134031U (en) * 1991-06-03 1992-12-14 株式会社カイジヨー Ultrasonic sludge interface meter

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53152565U (en) * 1977-05-06 1978-12-01

Also Published As

Publication number Publication date
JPS5714025B2 (en) 1982-03-20

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