JPS5189385A - - Google Patents

Info

Publication number
JPS5189385A
JPS5189385A JP50152913A JP15291375A JPS5189385A JP S5189385 A JPS5189385 A JP S5189385A JP 50152913 A JP50152913 A JP 50152913A JP 15291375 A JP15291375 A JP 15291375A JP S5189385 A JPS5189385 A JP S5189385A
Authority
JP
Japan
Prior art keywords
central planar
planar region
region
pellet
semiconductor pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50152913A
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5189385A publication Critical patent/JPS5189385A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/02—Manufacture or treatment of conductive package substrates serving as an interconnection, e.g. of metal plates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/136—Containers comprising a conductive base serving as an interconnection having other interconnections perpendicular to the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07631—Techniques
    • H10W72/07636—Soldering or alloying

Landscapes

  • Die Bonding (AREA)
  • Wire Bonding (AREA)
JP50152913A 1974-12-23 1975-12-23 Pending JPS5189385A (2)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/535,670 US3995310A (en) 1974-12-23 1974-12-23 Semiconductor assembly including mounting plate with recessed periphery

Publications (1)

Publication Number Publication Date
JPS5189385A true JPS5189385A (2) 1976-08-05

Family

ID=24135257

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50152913A Pending JPS5189385A (2) 1974-12-23 1975-12-23

Country Status (5)

Country Link
US (1) US3995310A (2)
JP (1) JPS5189385A (2)
DE (1) DE2557371A1 (2)
GB (1) GB1535195A (2)
SE (1) SE7514390L (2)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH630490A5 (de) 1978-06-30 1982-06-15 Bbc Brown Boveri & Cie Gehaeuse fuer ein halbleiter-hochleistungsbauelement.
DE3209174A1 (de) * 1982-03-13 1983-09-15 Brown, Boveri & Cie Ag, 6800 Mannheim Sandwich fuer druckkontaktierbare halbleiter-leistungsbauelemente und verfahren zu seiner herstellung
US4939619A (en) * 1987-01-26 1990-07-03 Northern Telecom Limited Packaged solid-state surge protector
EP0400177A1 (de) * 1989-05-31 1990-12-05 Siemens Aktiengesellschaft Verbindung eines Halbleiterbauelements mit einem Metallträger
US5166773A (en) * 1989-07-03 1992-11-24 General Electric Company Hermetic package and packaged semiconductor chip having closely spaced leads extending through the package lid
US5209390A (en) * 1989-07-03 1993-05-11 General Electric Company Hermetic package and packaged semiconductor chip having closely spaced leads extending through the package lid
JPH0671062B2 (ja) * 1989-08-30 1994-09-07 株式会社東芝 樹脂封止型半導体装置
DE10249206B3 (de) * 2002-10-22 2004-07-01 Siemens Ag Verfahren zum Zusammenbau eines Leistungsbauelements
DE10249205B3 (de) * 2002-10-22 2004-08-05 Siemens Ag Leistungsbauelementanordnung zur mechatronischen Integration von Leistungsbauelementen
DE102009032193A1 (de) * 2009-07-07 2011-01-13 Behr Gmbh & Co. Kg Verfahren zum fluiddichten Verbinden von zwei Bauelementen zur Herstellung einer fluiddichten Einheit und Kühlungseinheit zur Kühlung von Energiespeicherzellen

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3200310A (en) * 1959-09-22 1965-08-10 Carman Lab Inc Glass encapsulated semiconductor device
NL269308A (2) * 1960-09-16
GB1054422A (2) * 1963-03-16 1900-01-01
US3303432A (en) * 1966-04-18 1967-02-07 Gen Electric High power semiconductor laser devices
US3447118A (en) * 1966-08-16 1969-05-27 Westinghouse Electric Corp Stacking module for flat packaged electrical devices
GB1152809A (en) * 1968-05-07 1969-05-21 Standard Telephones Cables Ltd Electric Circuit Assembly
JPS5437474B1 (2) * 1968-06-10 1979-11-15
US3551758A (en) * 1969-01-08 1970-12-29 Westinghouse Electric Corp Fluid cooled heat sink assembly for pressure contacted semiconductor devices
US3831067A (en) * 1972-05-15 1974-08-20 Int Rectifier Corp Semiconductor device with pressure connection electrodes and with headers cemented to insulation ring
US3869787A (en) * 1973-01-02 1975-03-11 Honeywell Inf Systems Method for precisely aligning circuit devices coarsely positioned on a substrate
US3708720A (en) * 1973-01-02 1973-01-02 Franklin Electric Co Inc Semiconductor thermal protection

Also Published As

Publication number Publication date
US3995310A (en) 1976-11-30
SE7514390L (sv) 1976-06-24
DE2557371A1 (de) 1976-06-24
GB1535195A (en) 1978-12-13

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