JPS5199472A - - Google Patents

Info

Publication number: JPS5199472A
Authority: JP; Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP50024159A

Other languages

Japanese (ja)

Inventor

Katsuyuki Kawase

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

NEC Corp

Original Assignee

Nippon Electric Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1975-02-27

Filing date

1975-02-27

Publication date

1976-09-02

1975-02-27 Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd

1975-02-27 Priority to JP50024159A priority Critical patent/JPS5199472A/ja

1976-09-02 Publication of JPS5199472A publication Critical patent/JPS5199472A/ja

Status Pending legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07521—Aligning
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

Wire Bonding (AREA)

JP50024159A 1975-02-27 1975-02-27 Pending JPS5199472A (mo)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP50024159A JPS5199472A (mo)	1975-02-27	1975-02-27

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP50024159A JPS5199472A (mo)	1975-02-27	1975-02-27

Publications (1)

Publication Number	Publication Date
JPS5199472A true JPS5199472A (mo)	1976-09-02

Family

ID=12130545

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP50024159A Pending JPS5199472A (mo)	1975-02-27	1975-02-27

Country Status (1)

Country	Link
JP (1)	JPS5199472A (mo)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5482563U (mo) *	1977-11-22	1979-06-12
JPS5521149A (en) *	1978-08-01	1980-02-15	Nec Kyushu Ltd	Semiconductor interior connecting device

1975
- 1975-02-27 JP JP50024159A patent/JPS5199472A/ja active Pending

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5482563U (mo) *	1977-11-22	1979-06-12
JPS5521149A (en) *	1978-08-01	1980-02-15	Nec Kyushu Ltd	Semiconductor interior connecting device

Publication	Publication Date	Title
JPS5338592B2 (mo)	1978-10-16
JPS528097U (mo)	1977-01-20
JPS51125376U (mo)	1976-10-09
JPS5438420Y2 (mo)	1979-11-15
JPS5732871B2 (mo)	1982-07-13
JPS5250618U (mo)	1977-04-11
JPS5240212U (mo)	1977-03-22
JPS51136417U (mo)	1976-11-04
JPS51132831U (mo)	1976-10-26
JPS51133213U (mo)	1976-10-27
JPS51153274U (mo)	1976-12-07
CH604038A5 (mo)	1978-08-31
CH599497A5 (mo)	1978-05-31
CH613785A5 (mo)	1979-10-15
CH613561A5 (mo)	1979-09-28
CH588069A5 (mo)	1977-05-31
BG22215A1 (mo)	1977-02-20
CH592186A5 (mo)	1977-10-14
CH595195A5 (mo)	1978-02-15
BG22925A1 (mo)	1977-05-20
CH607073A5 (mo)	1978-11-30
CH607893A5 (mo)	1978-12-15
CH601609A5 (mo)	1978-07-14
CH609642A5 (mo)	1979-03-15
CH603499A5 (mo)	1978-08-15

JPS5199472A - - Google Patents

Info

Links

Classifications

Landscapes

Priority Applications (1)

Applications Claiming Priority (1)

Publications (1)

Family

ID=12130545

Family Applications (1)

Country Status (1)

Cited By (2)

Cited By (2)

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