JPS52113196A - Liquid crystal unit - Google Patents

Liquid crystal unit

Info

Publication number
JPS52113196A
JPS52113196A JP2973976A JP2973976A JPS52113196A JP S52113196 A JPS52113196 A JP S52113196A JP 2973976 A JP2973976 A JP 2973976A JP 2973976 A JP2973976 A JP 2973976A JP S52113196 A JPS52113196 A JP S52113196A
Authority
JP
Japan
Prior art keywords
liquid crystal
crystal unit
unifying
save
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2973976A
Other languages
Japanese (ja)
Inventor
Kanemitsu Kubota
Kiyoaki Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Epson Corp
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK, Epson Corp filed Critical Seiko Epson Corp
Priority to JP2973976A priority Critical patent/JPS52113196A/en
Publication of JPS52113196A publication Critical patent/JPS52113196A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)

Abstract

PURPOSE: To save the process and to decrease man-hours and cost, by unifying IC chip with the display unit thru the mixture of metalic powder and organic adhesives, in the electrode plate.
COPYRIGHT: (C)1977,JPO&Japio
JP2973976A 1976-03-18 1976-03-18 Liquid crystal unit Pending JPS52113196A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2973976A JPS52113196A (en) 1976-03-18 1976-03-18 Liquid crystal unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2973976A JPS52113196A (en) 1976-03-18 1976-03-18 Liquid crystal unit

Publications (1)

Publication Number Publication Date
JPS52113196A true JPS52113196A (en) 1977-09-22

Family

ID=12284464

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2973976A Pending JPS52113196A (en) 1976-03-18 1976-03-18 Liquid crystal unit

Country Status (1)

Country Link
JP (1) JPS52113196A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5657022A (en) * 1979-10-17 1981-05-19 Seiko Epson Corp Liquid crystal display device
JPS62218939A (en) * 1986-03-20 1987-09-26 Seiko Instr & Electronics Ltd Production of liquid crystal display device
JPS63250140A (en) * 1987-04-07 1988-10-18 Matsushita Electric Ind Co Ltd Mounting of semiconductor chip
JPH01226161A (en) * 1988-03-07 1989-09-08 Matsushita Electric Ind Co Ltd Connection of semiconductor chip
JPH01232735A (en) * 1988-03-11 1989-09-18 Matsushita Electric Ind Co Ltd Semiconductor device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5657022A (en) * 1979-10-17 1981-05-19 Seiko Epson Corp Liquid crystal display device
JPS62218939A (en) * 1986-03-20 1987-09-26 Seiko Instr & Electronics Ltd Production of liquid crystal display device
JPS63250140A (en) * 1987-04-07 1988-10-18 Matsushita Electric Ind Co Ltd Mounting of semiconductor chip
JPH01226161A (en) * 1988-03-07 1989-09-08 Matsushita Electric Ind Co Ltd Connection of semiconductor chip
JPH01232735A (en) * 1988-03-11 1989-09-18 Matsushita Electric Ind Co Ltd Semiconductor device

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