JPS52113363U - - Google Patents

Info

Publication number
JPS52113363U
JPS52113363U JP1976021318U JP2131876U JPS52113363U JP S52113363 U JPS52113363 U JP S52113363U JP 1976021318 U JP1976021318 U JP 1976021318U JP 2131876 U JP2131876 U JP 2131876U JP S52113363 U JPS52113363 U JP S52113363U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1976021318U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1976021318U priority Critical patent/JPS52113363U/ja
Publication of JPS52113363U publication Critical patent/JPS52113363U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/541Dispositions of bond wires
    • H10W72/5449Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/851Dispositions of multiple connectors or interconnections
    • H10W72/874On different surfaces
    • H10W72/884Die-attach connectors and bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/90Bond pads, in general
    • H10W72/931Shapes of bond pads
    • H10W72/932Plan-view shape, i.e. in top view

Landscapes

  • Electric Clocks (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1976021318U 1976-02-25 1976-02-25 Pending JPS52113363U (2)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1976021318U JPS52113363U (2) 1976-02-25 1976-02-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1976021318U JPS52113363U (2) 1976-02-25 1976-02-25

Publications (1)

Publication Number Publication Date
JPS52113363U true JPS52113363U (2) 1977-08-29

Family

ID=28481301

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1976021318U Pending JPS52113363U (2) 1976-02-25 1976-02-25

Country Status (1)

Country Link
JP (1) JPS52113363U (2)

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