JPS5212063A - Hair curling apparatus - Google Patents
Hair curling apparatusInfo
- Publication number
- JPS5212063A JPS5212063A JP8681375A JP8681375A JPS5212063A JP S5212063 A JPS5212063 A JP S5212063A JP 8681375 A JP8681375 A JP 8681375A JP 8681375 A JP8681375 A JP 8681375A JP S5212063 A JPS5212063 A JP S5212063A
- Authority
- JP
- Japan
- Prior art keywords
- hair curling
- curling apparatus
- hair
- humidity
- damage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cleaning And Drying Hair (AREA)
Abstract
PURPOSE: To provide hair with highly durable curl without damage thereto by producing a wet air having given temperature and humidity.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8681375A JPS5212063A (en) | 1975-07-15 | 1975-07-15 | Hair curling apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8681375A JPS5212063A (en) | 1975-07-15 | 1975-07-15 | Hair curling apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5212063A true JPS5212063A (en) | 1977-01-29 |
Family
ID=13897240
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8681375A Pending JPS5212063A (en) | 1975-07-15 | 1975-07-15 | Hair curling apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5212063A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5050869A (en) * | 1973-09-05 | 1975-05-07 | ||
| JPS61164030U (en) * | 1985-03-28 | 1986-10-11 | ||
| JPH01135024A (en) * | 1987-11-20 | 1989-05-26 | Mitsui Petrochem Ind Ltd | Washing |
| JPH04179225A (en) * | 1990-11-14 | 1992-06-25 | Ebara Res Co Ltd | Cleaning method |
| US6267125B1 (en) | 1997-05-09 | 2001-07-31 | Semitool, Inc. | Apparatus and method for processing the surface of a workpiece with ozone |
| US6830628B2 (en) | 1997-05-09 | 2004-12-14 | Semitool, Inc. | Methods for cleaning semiconductor surfaces |
| US6837252B2 (en) | 1997-05-09 | 2005-01-04 | Semitool, Inc. | Apparatus for treating a workpiece with steam and ozone |
| US7264680B2 (en) | 1997-05-09 | 2007-09-04 | Semitool, Inc. | Process and apparatus for treating a workpiece using ozone |
| US7378355B2 (en) | 1997-05-09 | 2008-05-27 | Semitool, Inc. | System and methods for polishing a wafer |
| US7404863B2 (en) | 1997-05-09 | 2008-07-29 | Semitool, Inc. | Methods of thinning a silicon wafer using HF and ozone |
-
1975
- 1975-07-15 JP JP8681375A patent/JPS5212063A/en active Pending
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5050869A (en) * | 1973-09-05 | 1975-05-07 | ||
| JPS61164030U (en) * | 1985-03-28 | 1986-10-11 | ||
| JPH01135024A (en) * | 1987-11-20 | 1989-05-26 | Mitsui Petrochem Ind Ltd | Washing |
| JPH04179225A (en) * | 1990-11-14 | 1992-06-25 | Ebara Res Co Ltd | Cleaning method |
| US6267125B1 (en) | 1997-05-09 | 2001-07-31 | Semitool, Inc. | Apparatus and method for processing the surface of a workpiece with ozone |
| US6273108B1 (en) | 1997-05-09 | 2001-08-14 | Semitool, Inc. | Apparatus and method for processing the surface of a workpiece with ozone |
| US6497768B2 (en) | 1997-05-09 | 2002-12-24 | Semitool, Inc. | Process for treating a workpiece with hydrofluoric acid and ozone |
| US6591845B1 (en) | 1997-05-09 | 2003-07-15 | Semitool, Inc. | Apparatus and method for processing the surface of a workpiece with ozone |
| US6701941B1 (en) | 1997-05-09 | 2004-03-09 | Semitool, Inc. | Method for treating the surface of a workpiece |
| US6817370B2 (en) | 1997-05-09 | 2004-11-16 | Semitool, Inc. | Method for processing the surface of a workpiece |
| US6830628B2 (en) | 1997-05-09 | 2004-12-14 | Semitool, Inc. | Methods for cleaning semiconductor surfaces |
| US6837252B2 (en) | 1997-05-09 | 2005-01-04 | Semitool, Inc. | Apparatus for treating a workpiece with steam and ozone |
| US6843857B2 (en) | 1997-05-09 | 2005-01-18 | Semitool, Inc. | Methods for cleaning semiconductor surfaces |
| US6869487B1 (en) | 1997-05-09 | 2005-03-22 | Semitool, Inc. | Process and apparatus for treating a workpiece such as a semiconductor wafer |
| US7264680B2 (en) | 1997-05-09 | 2007-09-04 | Semitool, Inc. | Process and apparatus for treating a workpiece using ozone |
| US7378355B2 (en) | 1997-05-09 | 2008-05-27 | Semitool, Inc. | System and methods for polishing a wafer |
| US7404863B2 (en) | 1997-05-09 | 2008-07-29 | Semitool, Inc. | Methods of thinning a silicon wafer using HF and ozone |
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