JPS52121776A - Polyimide film stack and printed circuit board* flat cable or integrated circuit carrier tape using same - Google Patents

Polyimide film stack and printed circuit board* flat cable or integrated circuit carrier tape using same

Info

Publication number
JPS52121776A
JPS52121776A JP3782376A JP3782376A JPS52121776A JP S52121776 A JPS52121776 A JP S52121776A JP 3782376 A JP3782376 A JP 3782376A JP 3782376 A JP3782376 A JP 3782376A JP S52121776 A JPS52121776 A JP S52121776A
Authority
JP
Japan
Prior art keywords
same
polyimide film
flat cable
carrier tape
film stack
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3782376A
Other languages
Japanese (ja)
Other versions
JPS5830755B2 (en
Inventor
Kazumi Nagai
Hideki Fujimoto
Kazuo Kobori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP51037823A priority Critical patent/JPS5830755B2/en
Publication of JPS52121776A publication Critical patent/JPS52121776A/en
Publication of JPS5830755B2 publication Critical patent/JPS5830755B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
  • Laminated Bodies (AREA)
JP51037823A 1976-04-06 1976-04-06 Polyimide film laminate for metal lamination Expired JPS5830755B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP51037823A JPS5830755B2 (en) 1976-04-06 1976-04-06 Polyimide film laminate for metal lamination

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP51037823A JPS5830755B2 (en) 1976-04-06 1976-04-06 Polyimide film laminate for metal lamination

Publications (2)

Publication Number Publication Date
JPS52121776A true JPS52121776A (en) 1977-10-13
JPS5830755B2 JPS5830755B2 (en) 1983-07-01

Family

ID=12508229

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51037823A Expired JPS5830755B2 (en) 1976-04-06 1976-04-06 Polyimide film laminate for metal lamination

Country Status (1)

Country Link
JP (1) JPS5830755B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5710294A (en) * 1980-06-23 1982-01-19 Furukawa Electric Co Ltd Method of producing flexible printed circuit board
JPS58210687A (en) * 1982-05-31 1983-12-07 松下電工株式会社 Method of producing aditive substrate
KR20190132435A (en) * 2017-03-20 2019-11-27 바스프 에스이 Laminates Containing Metal and Polyamide Compositions

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5710294A (en) * 1980-06-23 1982-01-19 Furukawa Electric Co Ltd Method of producing flexible printed circuit board
JPS58210687A (en) * 1982-05-31 1983-12-07 松下電工株式会社 Method of producing aditive substrate
KR20190132435A (en) * 2017-03-20 2019-11-27 바스프 에스이 Laminates Containing Metal and Polyamide Compositions
JP2020514139A (en) * 2017-03-20 2020-05-21 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ Laminate containing metal and polyamide composition

Also Published As

Publication number Publication date
JPS5830755B2 (en) 1983-07-01

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