JPS52124866A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS52124866A
JPS52124866A JP4127576A JP4127576A JPS52124866A JP S52124866 A JPS52124866 A JP S52124866A JP 4127576 A JP4127576 A JP 4127576A JP 4127576 A JP4127576 A JP 4127576A JP S52124866 A JPS52124866 A JP S52124866A
Authority
JP
Japan
Prior art keywords
semiconductor device
film
prefectly
corrosion
prevent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4127576A
Other languages
Japanese (ja)
Inventor
Eiichi Yamada
Akira Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4127576A priority Critical patent/JPS52124866A/en
Publication of JPS52124866A publication Critical patent/JPS52124866A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE: To prefectly prevent the corrosion of a Ni-Cr film by completely covering the Ni-Cr alloy formed for the purpose of connecting to an Al wiring film with an Au film.
COPYRIGHT: (C)1977,JPO&Japio
JP4127576A 1976-04-14 1976-04-14 Semiconductor device Pending JPS52124866A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4127576A JPS52124866A (en) 1976-04-14 1976-04-14 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4127576A JPS52124866A (en) 1976-04-14 1976-04-14 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS52124866A true JPS52124866A (en) 1977-10-20

Family

ID=12603883

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4127576A Pending JPS52124866A (en) 1976-04-14 1976-04-14 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS52124866A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61234050A (en) * 1985-04-10 1986-10-18 Sanyo Electric Co Ltd Semiconductor integrated circuit having multilayer interconnection

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61234050A (en) * 1985-04-10 1986-10-18 Sanyo Electric Co Ltd Semiconductor integrated circuit having multilayer interconnection

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