JPS52137778U - - Google Patents

Info

Publication number
JPS52137778U
JPS52137778U JP1976046070U JP4607076U JPS52137778U JP S52137778 U JPS52137778 U JP S52137778U JP 1976046070 U JP1976046070 U JP 1976046070U JP 4607076 U JP4607076 U JP 4607076U JP S52137778 U JPS52137778 U JP S52137778U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1976046070U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1976046070U priority Critical patent/JPS52137778U/ja
Publication of JPS52137778U publication Critical patent/JPS52137778U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
JP1976046070U 1976-04-15 1976-04-15 Pending JPS52137778U (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1976046070U JPS52137778U (fr) 1976-04-15 1976-04-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1976046070U JPS52137778U (fr) 1976-04-15 1976-04-15

Publications (1)

Publication Number Publication Date
JPS52137778U true JPS52137778U (fr) 1977-10-19

Family

ID=28505169

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1976046070U Pending JPS52137778U (fr) 1976-04-15 1976-04-15

Country Status (1)

Country Link
JP (1) JPS52137778U (fr)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4978490A (fr) * 1972-11-30 1974-07-29

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4978490A (fr) * 1972-11-30 1974-07-29

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