JPS52148045U - - Google Patents
Info
- Publication number
- JPS52148045U JPS52148045U JP5676476U JP5676476U JPS52148045U JP S52148045 U JPS52148045 U JP S52148045U JP 5676476 U JP5676476 U JP 5676476U JP 5676476 U JP5676476 U JP 5676476U JP S52148045 U JPS52148045 U JP S52148045U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5676476U JPS52148045U (it) | 1976-05-06 | 1976-05-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5676476U JPS52148045U (it) | 1976-05-06 | 1976-05-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS52148045U true JPS52148045U (it) | 1977-11-09 |
Family
ID=28515703
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5676476U Pending JPS52148045U (it) | 1976-05-06 | 1976-05-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS52148045U (it) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008526037A (ja) * | 2004-12-30 | 2008-07-17 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | 電子回路の製造方法 |
| JP2014143373A (ja) * | 2013-01-25 | 2014-08-07 | Mitsubishi Electric Corp | 半導体装置および半導体装置の製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4933914A (it) * | 1972-06-09 | 1974-03-28 |
-
1976
- 1976-05-06 JP JP5676476U patent/JPS52148045U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4933914A (it) * | 1972-06-09 | 1974-03-28 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008526037A (ja) * | 2004-12-30 | 2008-07-17 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | 電子回路の製造方法 |
| JP2014143373A (ja) * | 2013-01-25 | 2014-08-07 | Mitsubishi Electric Corp | 半導体装置および半導体装置の製造方法 |