JPS5217334A - Electroless copper plating solution - Google Patents

Electroless copper plating solution

Info

Publication number
JPS5217334A
JPS5217334A JP9316075A JP9316075A JPS5217334A JP S5217334 A JPS5217334 A JP S5217334A JP 9316075 A JP9316075 A JP 9316075A JP 9316075 A JP9316075 A JP 9316075A JP S5217334 A JPS5217334 A JP S5217334A
Authority
JP
Japan
Prior art keywords
plating solution
copper plating
electroless copper
electroless
solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9316075A
Other languages
Japanese (ja)
Inventor
Kanji Murakami
Mineo Kawamoto
Mototsugu Kazushima
Yasusada Morishita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9316075A priority Critical patent/JPS5217334A/en
Publication of JPS5217334A publication Critical patent/JPS5217334A/en
Pending legal-status Critical Current

Links

Landscapes

  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP9316075A 1975-08-01 1975-08-01 Electroless copper plating solution Pending JPS5217334A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9316075A JPS5217334A (en) 1975-08-01 1975-08-01 Electroless copper plating solution

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9316075A JPS5217334A (en) 1975-08-01 1975-08-01 Electroless copper plating solution

Publications (1)

Publication Number Publication Date
JPS5217334A true JPS5217334A (en) 1977-02-09

Family

ID=14074789

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9316075A Pending JPS5217334A (en) 1975-08-01 1975-08-01 Electroless copper plating solution

Country Status (1)

Country Link
JP (1) JPS5217334A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1196016A3 (en) * 2000-10-03 2004-06-30 Hitachi, Ltd. Wiring substrate and manufacturing method of the same along with electroless copper plating solution used therefor
US7473307B2 (en) 2007-03-13 2009-01-06 Samsung Electronics Co., Ltd. Electroless copper plating solution, method of producing the same and electroless copper plating method
US8734097B2 (en) 2006-05-24 2014-05-27 Resmed Motor Technologies Inc Compact low noise efficient blower for CPAP devices

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1196016A3 (en) * 2000-10-03 2004-06-30 Hitachi, Ltd. Wiring substrate and manufacturing method of the same along with electroless copper plating solution used therefor
US6831009B2 (en) 2000-10-03 2004-12-14 Hitachi, Ltd. Wiring substrate and an electroless copper plating solution for providing interlayer connections
US6989329B2 (en) 2000-10-03 2006-01-24 Hitachi, Ltd. Method of manufacturing a wiring substrate and an electroless copper plating solution for providing interlayer connections
US8734097B2 (en) 2006-05-24 2014-05-27 Resmed Motor Technologies Inc Compact low noise efficient blower for CPAP devices
US9677563B2 (en) 2006-05-24 2017-06-13 Resmed Motor Technologies Inc. Compact low noise efficient blower for CPAP devices
US10605246B2 (en) 2006-05-24 2020-03-31 Resmed Motor Technologies Inc. Compact low noise efficient blower for CPAP devices
US11353030B2 (en) 2006-05-24 2022-06-07 Resmed Motor Technologies Inc. Compact low noise efficient blower for CPAP devices
US11892000B2 (en) 2006-05-24 2024-02-06 Resmed Motor Technologies Inc. Compact low noise efficient blower for CPAP devices
US7473307B2 (en) 2007-03-13 2009-01-06 Samsung Electronics Co., Ltd. Electroless copper plating solution, method of producing the same and electroless copper plating method

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