JPS5227273A - Resin seal type semiconductor unit - Google Patents

Resin seal type semiconductor unit

Info

Publication number
JPS5227273A
JPS5227273A JP50102198A JP10219875A JPS5227273A JP S5227273 A JPS5227273 A JP S5227273A JP 50102198 A JP50102198 A JP 50102198A JP 10219875 A JP10219875 A JP 10219875A JP S5227273 A JPS5227273 A JP S5227273A
Authority
JP
Japan
Prior art keywords
type semiconductor
seal type
semiconductor unit
resin seal
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50102198A
Other languages
Japanese (ja)
Inventor
Toshihiko Ogu
Eiichi Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50102198A priority Critical patent/JPS5227273A/en
Publication of JPS5227273A publication Critical patent/JPS5227273A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To provide a moisture-free resin seal type semiconductor unit by eliminating gaps between the semiconductor and resin mold.
JP50102198A 1975-08-25 1975-08-25 Resin seal type semiconductor unit Pending JPS5227273A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50102198A JPS5227273A (en) 1975-08-25 1975-08-25 Resin seal type semiconductor unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50102198A JPS5227273A (en) 1975-08-25 1975-08-25 Resin seal type semiconductor unit

Publications (1)

Publication Number Publication Date
JPS5227273A true JPS5227273A (en) 1977-03-01

Family

ID=14320952

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50102198A Pending JPS5227273A (en) 1975-08-25 1975-08-25 Resin seal type semiconductor unit

Country Status (1)

Country Link
JP (1) JPS5227273A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5519711U (en) * 1978-07-22 1980-02-07

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5519711U (en) * 1978-07-22 1980-02-07

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