JPS5228261A - Process for forming semiconductor electrodes - Google Patents

Process for forming semiconductor electrodes

Info

Publication number
JPS5228261A
JPS5228261A JP50103952A JP10395275A JPS5228261A JP S5228261 A JPS5228261 A JP S5228261A JP 50103952 A JP50103952 A JP 50103952A JP 10395275 A JP10395275 A JP 10395275A JP S5228261 A JPS5228261 A JP S5228261A
Authority
JP
Japan
Prior art keywords
forming semiconductor
semiconductor electrodes
strength
electrodes
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50103952A
Other languages
Japanese (ja)
Inventor
Tomoyuki Tanaka
Takuzo Ogawa
Hideyuki Yagi
Masahiro Okamura
Yutaka Misawa
Yasumichi Yasuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50103952A priority Critical patent/JPS5228261A/en
Publication of JPS5228261A publication Critical patent/JPS5228261A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Bipolar Transistors (AREA)
  • Formation Of Insulating Films (AREA)

Abstract

PURPOSE: To form a pattern of very small electrode by utilizing small ratio of bonding strength between the strength of AU and oxidized film and between that of AU and substrate.
COPYRIGHT: (C)1977,JPO&Japio
JP50103952A 1975-08-29 1975-08-29 Process for forming semiconductor electrodes Pending JPS5228261A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50103952A JPS5228261A (en) 1975-08-29 1975-08-29 Process for forming semiconductor electrodes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50103952A JPS5228261A (en) 1975-08-29 1975-08-29 Process for forming semiconductor electrodes

Publications (1)

Publication Number Publication Date
JPS5228261A true JPS5228261A (en) 1977-03-03

Family

ID=14367743

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50103952A Pending JPS5228261A (en) 1975-08-29 1975-08-29 Process for forming semiconductor electrodes

Country Status (1)

Country Link
JP (1) JPS5228261A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54102869A (en) * 1978-01-30 1979-08-13 Nec Home Electronics Ltd Manufacture for semiconductor device
US5240878A (en) * 1991-04-26 1993-08-31 International Business Machines Corporation Method for forming patterned films on a substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54102869A (en) * 1978-01-30 1979-08-13 Nec Home Electronics Ltd Manufacture for semiconductor device
US5240878A (en) * 1991-04-26 1993-08-31 International Business Machines Corporation Method for forming patterned films on a substrate

Similar Documents

Publication Publication Date Title
JPS528785A (en) Semiconductor device electrode structure
JPS5228261A (en) Process for forming semiconductor electrodes
JPS51151069A (en) Electrode forming method of a semiconductor element
JPS5219975A (en) Semiconductor device
JPS5274280A (en) Semiconductor device and its production
JPS5321570A (en) Bonding method of semiconductor substrates
JPS5267271A (en) Formation of through-hole onto semiconductor substrate
JPS5223281A (en) Method of manufacturing semiconductor device
JPS5310266A (en) Production of soldred semiconductor wafers
JPS5228262A (en) Process for assembling semiconductor device
JPS5254373A (en) Packaging construction for semiconductor element
JPS51123086A (en) Semicanductor device and its production process
JPS5251872A (en) Production of semiconductor device
JPS53140967A (en) Production of electrodes of semiconductor device
JPS535571A (en) Circuit block and its manufacture
JPS5263674A (en) Semiconductor device
JPS5273675A (en) Structure of die bonding
JPS52130292A (en) Patterning method
JPS5333057A (en) Bump type semiconductor device
JPS51112266A (en) Semiconductor device production method
JPS51112292A (en) Semiconductor device
JPS5259588A (en) Production of semiconductor element
JPS51147958A (en) Method for forming metal electrode
JPS5258370A (en) Semiconductor device
JPS5352365A (en) Semiconductor device