JPS5228266A - Semiconductor element and method of manufacture thereof - Google Patents

Semiconductor element and method of manufacture thereof

Info

Publication number
JPS5228266A
JPS5228266A JP51092407A JP9240776A JPS5228266A JP S5228266 A JPS5228266 A JP S5228266A JP 51092407 A JP51092407 A JP 51092407A JP 9240776 A JP9240776 A JP 9240776A JP S5228266 A JPS5228266 A JP S5228266A
Authority
JP
Japan
Prior art keywords
manufacture
semiconductor element
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP51092407A
Other languages
Japanese (ja)
Other versions
JPS584816B2 (en
Inventor
Jiyon Yaaman Arekisandaa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/601,839 external-priority patent/US4017340A/en
Application filed by General Electric Co filed Critical General Electric Co
Publication of JPS5228266A publication Critical patent/JPS5228266A/en
Publication of JPS584816B2 publication Critical patent/JPS584816B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/137—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being directly on the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/147—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being multilayered
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/43—Encapsulations, e.g. protective coatings characterised by their materials comprising oxides, nitrides or carbides, e.g. ceramics or glasses

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Formation Of Insulating Films (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP51092407A 1975-08-04 1976-08-04 Semiconductor elements and their manufacturing methods Expired JPS584816B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US60183875A 1975-08-04 1975-08-04
US05/601,839 US4017340A (en) 1975-08-04 1975-08-04 Semiconductor element having a polymeric protective coating and glass coating overlay

Publications (2)

Publication Number Publication Date
JPS5228266A true JPS5228266A (en) 1977-03-03
JPS584816B2 JPS584816B2 (en) 1983-01-27

Family

ID=27083963

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51092407A Expired JPS584816B2 (en) 1975-08-04 1976-08-04 Semiconductor elements and their manufacturing methods

Country Status (6)

Country Link
JP (1) JPS584816B2 (en)
DE (1) DE2634568C2 (en)
FR (1) FR2320634A1 (en)
GB (1) GB1553243A (en)
NL (1) NL185044C (en)
SE (1) SE429699B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5978954A (en) * 1982-10-22 1984-05-08 Nitto Electric Ind Co Ltd Coating material for optical glass fiber
JPS60207340A (en) * 1984-03-31 1985-10-18 Toshiba Corp Semiconductor device and manufacture thereof
JP2018113292A (en) * 2017-01-10 2018-07-19 三菱電機株式会社 Power semiconductor device

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE418433B (en) * 1975-12-11 1981-05-25 Gen Electric SEMICONDUCTOR ELEMENT WITH A LAYER OF A POLYMERIC SILOXAN-CONTAINING MEMBRANE MEMBRANE MATERIAL WITH VARIABLE PERMEABILITY APPLIED ON SELECTED SURFACE OF THE ELEMENT
GB1563421A (en) * 1975-12-18 1980-03-26 Gen Electric Polyimide-siloxane copolymer protective coating for semiconductor devices
EP0347518A1 (en) * 1988-03-28 1989-12-27 Asea Brown Boveri Ag Passivation of a semiconductor device
WO1997012403A1 (en) * 1995-09-27 1997-04-03 Hitachi, Ltd. Diode
FR2797995B1 (en) * 1999-08-25 2002-03-22 Gemplus Card Int METHOD FOR PROTECTING INTEGRATED CIRCUIT CHIPS BY INSULATING THIN FILM DEPOSITION
FR2797996B1 (en) * 1999-08-25 2003-10-03 Gemplus Card Int METHOD FOR PROTECTING INTEGRATED CIRCUIT CHIPS BY INSULATING THIN FILM DEPOSITION
DE102007033288A1 (en) 2007-07-17 2009-01-22 Siemens Ag Electronic component and device with high insulation resistance and method for their production
EP3113219B1 (en) * 2015-06-30 2020-03-11 SEMIKRON Elektronik GmbH & Co. KG Semiconductor device and manufacturing method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3615913A (en) * 1968-11-08 1971-10-26 Westinghouse Electric Corp Polyimide and polyamide-polyimide as a semiconductor surface passivator and protectant coating
JPS4723980U (en) * 1971-03-19 1972-11-17
JPS4918586A (en) * 1972-06-14 1974-02-19

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3034079A (en) * 1959-05-11 1962-05-08 Microwave Ass Hermetically sealed semiconductors
US3338859A (en) * 1966-06-30 1967-08-29 Dow Corning Silicone polyimides
US3481781A (en) * 1967-03-17 1969-12-02 Rca Corp Silicate glass coating of semiconductor devices
US3619733A (en) * 1969-08-18 1971-11-09 Rca Corp Semiconductor device with multilevel metalization and method of making the same
US3597269A (en) * 1969-09-30 1971-08-03 Westinghouse Electric Corp Surfce stabilization of semiconductor power devices and article
IE35063B1 (en) * 1970-05-22 1975-10-29 Gen Electric Semiconductor device with polymeric passivant bonded preform
US3643136A (en) * 1970-05-22 1972-02-15 Gen Electric Glass passivated double beveled semiconductor device with partially spaced preform
IE35247B1 (en) * 1970-06-08 1975-12-24 Gen Electric Improvements in ceramic passivated semi-conductor device and process for its manufacture
US3740305A (en) * 1971-10-01 1973-06-19 Gen Electric Composite materials bonded with siloxane containing polyimides

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3615913A (en) * 1968-11-08 1971-10-26 Westinghouse Electric Corp Polyimide and polyamide-polyimide as a semiconductor surface passivator and protectant coating
JPS4723980U (en) * 1971-03-19 1972-11-17
JPS4918586A (en) * 1972-06-14 1974-02-19

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5978954A (en) * 1982-10-22 1984-05-08 Nitto Electric Ind Co Ltd Coating material for optical glass fiber
JPS60207340A (en) * 1984-03-31 1985-10-18 Toshiba Corp Semiconductor device and manufacture thereof
JP2018113292A (en) * 2017-01-10 2018-07-19 三菱電機株式会社 Power semiconductor device

Also Published As

Publication number Publication date
FR2320634B1 (en) 1983-01-07
NL185044C (en) 1990-01-02
SE7608727L (en) 1977-02-05
SE429699B (en) 1983-09-19
NL7608544A (en) 1977-02-08
DE2634568C2 (en) 1985-06-20
FR2320634A1 (en) 1977-03-04
GB1553243A (en) 1979-09-26
JPS584816B2 (en) 1983-01-27
NL185044B (en) 1989-08-01
DE2634568A1 (en) 1977-02-17

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