JPS5230837A - Thermostable compositions for use in adhesives and thermostable lamina ted boards - Google Patents

Thermostable compositions for use in adhesives and thermostable lamina ted boards

Info

Publication number
JPS5230837A
JPS5230837A JP10680875A JP10680875A JPS5230837A JP S5230837 A JPS5230837 A JP S5230837A JP 10680875 A JP10680875 A JP 10680875A JP 10680875 A JP10680875 A JP 10680875A JP S5230837 A JPS5230837 A JP S5230837A
Authority
JP
Japan
Prior art keywords
thermostable
adhesives
boards
compositions
lamina
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10680875A
Other languages
Japanese (ja)
Inventor
Itsuo Matsuda
Takara Fujii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Chemical Products Co Ltd
Kyocera Chemical Corp
Original Assignee
Toshiba Chemical Products Co Ltd
Toshiba Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Products Co Ltd, Toshiba Chemical Corp filed Critical Toshiba Chemical Products Co Ltd
Priority to JP10680875A priority Critical patent/JPS5230837A/en
Publication of JPS5230837A publication Critical patent/JPS5230837A/en
Pending legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE: A thermostable composition for use in adhesives comprising a nitrile rubber, epoxy compound and an amine curing agent for epoxy resins, and a thermostable laminated board prepared by bonding thermostable base using the composition mentioned above.
COPYRIGHT: (C)1977,JPO&Japio
JP10680875A 1975-09-03 1975-09-03 Thermostable compositions for use in adhesives and thermostable lamina ted boards Pending JPS5230837A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10680875A JPS5230837A (en) 1975-09-03 1975-09-03 Thermostable compositions for use in adhesives and thermostable lamina ted boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10680875A JPS5230837A (en) 1975-09-03 1975-09-03 Thermostable compositions for use in adhesives and thermostable lamina ted boards

Publications (1)

Publication Number Publication Date
JPS5230837A true JPS5230837A (en) 1977-03-08

Family

ID=14443139

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10680875A Pending JPS5230837A (en) 1975-09-03 1975-09-03 Thermostable compositions for use in adhesives and thermostable lamina ted boards

Country Status (1)

Country Link
JP (1) JPS5230837A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5738872A (en) * 1980-08-21 1982-03-03 Toshiba Chem Corp Heat-resistant adhesive composition and heat-resistant laminate
JPS5770167A (en) * 1980-10-21 1982-04-30 Suriibondo:Kk Adhesive composition
JPS58125717A (en) * 1982-01-20 1983-07-26 Toshiba Chem Corp Heat-resistant resin composition
JPS5981370A (en) * 1982-10-30 1984-05-11 Matsushita Electric Works Ltd Adhesive for electric circuit laminate
JPS5981368A (en) * 1982-10-30 1984-05-11 Matsushita Electric Works Ltd Adhesive for electric circuit laminate
JPS5981369A (en) * 1982-10-30 1984-05-11 Matsushita Electric Works Ltd Adhesive for electric circuit laminate
US4482659A (en) * 1983-10-21 1984-11-13 Westinghouse Electric Corp. Toughened thermosetting compositions for composites
JPS62246977A (en) * 1986-04-18 1987-10-28 Nippon Zeon Co Ltd Adhesive for electrical circuit laminates
JPH07197248A (en) * 1993-11-24 1995-08-01 Applied Materials Inc Integrated sputtering target assembly

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5738872A (en) * 1980-08-21 1982-03-03 Toshiba Chem Corp Heat-resistant adhesive composition and heat-resistant laminate
JPS5770167A (en) * 1980-10-21 1982-04-30 Suriibondo:Kk Adhesive composition
JPS58125717A (en) * 1982-01-20 1983-07-26 Toshiba Chem Corp Heat-resistant resin composition
JPS5981370A (en) * 1982-10-30 1984-05-11 Matsushita Electric Works Ltd Adhesive for electric circuit laminate
JPS5981368A (en) * 1982-10-30 1984-05-11 Matsushita Electric Works Ltd Adhesive for electric circuit laminate
JPS5981369A (en) * 1982-10-30 1984-05-11 Matsushita Electric Works Ltd Adhesive for electric circuit laminate
US4482659A (en) * 1983-10-21 1984-11-13 Westinghouse Electric Corp. Toughened thermosetting compositions for composites
JPS62246977A (en) * 1986-04-18 1987-10-28 Nippon Zeon Co Ltd Adhesive for electrical circuit laminates
JPH07197248A (en) * 1993-11-24 1995-08-01 Applied Materials Inc Integrated sputtering target assembly

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