JPS5237771A - Process for production of semiconductor - Google Patents

Process for production of semiconductor

Info

Publication number
JPS5237771A
JPS5237771A JP50114186A JP11418675A JPS5237771A JP S5237771 A JPS5237771 A JP S5237771A JP 50114186 A JP50114186 A JP 50114186A JP 11418675 A JP11418675 A JP 11418675A JP S5237771 A JPS5237771 A JP S5237771A
Authority
JP
Japan
Prior art keywords
semiconductor
production
reliability
plastic
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50114186A
Other languages
Japanese (ja)
Other versions
JPS5550383B2 (en
Inventor
Tsukasa Sawaki
Kenji Mitsui
Kanji Mizukoshi
Takashi Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP50114186A priority Critical patent/JPS5237771A/en
Publication of JPS5237771A publication Critical patent/JPS5237771A/en
Publication of JPS5550383B2 publication Critical patent/JPS5550383B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: Reliability of die bonding and wire bonding in a plastic-sealed semiconductor device is improved.
COPYRIGHT: (C)1977,JPO&Japio
JP50114186A 1975-09-19 1975-09-19 Process for production of semiconductor Granted JPS5237771A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50114186A JPS5237771A (en) 1975-09-19 1975-09-19 Process for production of semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50114186A JPS5237771A (en) 1975-09-19 1975-09-19 Process for production of semiconductor

Publications (2)

Publication Number Publication Date
JPS5237771A true JPS5237771A (en) 1977-03-23
JPS5550383B2 JPS5550383B2 (en) 1980-12-17

Family

ID=14631337

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50114186A Granted JPS5237771A (en) 1975-09-19 1975-09-19 Process for production of semiconductor

Country Status (1)

Country Link
JP (1) JPS5237771A (en)

Also Published As

Publication number Publication date
JPS5550383B2 (en) 1980-12-17

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