JPS5239766B2 - - Google Patents

Info

Publication number
JPS5239766B2
JPS5239766B2 JP49047042A JP4704274A JPS5239766B2 JP S5239766 B2 JPS5239766 B2 JP S5239766B2 JP 49047042 A JP49047042 A JP 49047042A JP 4704274 A JP4704274 A JP 4704274A JP S5239766 B2 JPS5239766 B2 JP S5239766B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP49047042A
Other languages
Japanese (ja)
Other versions
JPS5013228A (fr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5013228A publication Critical patent/JPS5013228A/ja
Publication of JPS5239766B2 publication Critical patent/JPS5239766B2/ja
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28Sensitising or activating
    • C23C18/30Activating or accelerating or sensitising with palladium or other noble metal
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
JP49047042A 1973-04-30 1974-04-24 Expired JPS5239766B2 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US355720A US3877981A (en) 1973-04-30 1973-04-30 Method of electroless plating

Publications (2)

Publication Number Publication Date
JPS5013228A JPS5013228A (fr) 1975-02-12
JPS5239766B2 true JPS5239766B2 (fr) 1977-10-07

Family

ID=23398564

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49047042A Expired JPS5239766B2 (fr) 1973-04-30 1974-04-24

Country Status (3)

Country Link
US (1) US3877981A (fr)
JP (1) JPS5239766B2 (fr)
BE (1) BE814359A (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4264646A (en) * 1979-03-12 1981-04-28 Xerox Corporation Selectively electrolessly depositing a metal pattern on the surface of a laminar film
DE3202484A1 (de) * 1982-01-27 1983-08-04 Bayer Ag, 5090 Leverkusen Metallisierte halbleiter und verfahren zu ihrer herstellung
US4478883A (en) * 1982-07-14 1984-10-23 International Business Machines Corporation Conditioning of a substrate for electroless direct bond plating in holes and on surfaces of a substrate
US5472524A (en) * 1990-05-17 1995-12-05 The Boeing Company Non-chromated cobalt conversion coating method and coated articles
US5468307A (en) * 1990-05-17 1995-11-21 Schriever; Matthias P. Non-chromated oxide coating for aluminum substrates
US5411606A (en) * 1990-05-17 1995-05-02 The Boeing Company Non-chromated oxide coating for aluminum substrates
US5551994A (en) * 1990-05-17 1996-09-03 The Boeing Company Non-chromated oxide coating for aluminum substrates
US5298092A (en) * 1990-05-17 1994-03-29 The Boeing Company Non-chromated oxide coating for aluminum substrates
US5873953A (en) * 1996-12-26 1999-02-23 The Boeing Company Non-chromated oxide coating for aluminum substrates
US6432225B1 (en) 1999-11-02 2002-08-13 The Boeing Company Non-chromated oxide coating for aluminum substrates
JP3656612B2 (ja) * 2001-06-08 2005-06-08 株式会社村田製作所 金属膜およびその製造方法ならびに積層セラミック電子部品およびその製造方法
US6852152B2 (en) * 2002-09-24 2005-02-08 International Business Machines Corporation Colloidal seed formulation for printed circuit board metallization

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2490760A (en) * 1946-04-15 1949-12-06 Eastman Kodak Co Water spot prevention in photographic film
US2556540A (en) * 1946-04-15 1951-06-12 Eastman Kodak Co Water spot prevention in photographic film
US3399268A (en) * 1966-06-07 1968-08-27 Photocircuits Corp Chemical metallization and products produced thereby
US3607379A (en) * 1968-01-22 1971-09-21 Us Navy Microelectronic interconnection substrate
SE332214B (fr) * 1968-07-12 1971-02-01 Gylling & Co
US3674550A (en) * 1970-03-04 1972-07-04 Allied Res Prod Inc Method of electroless deposition of a substrate and sensitizing solution therefor

Also Published As

Publication number Publication date
JPS5013228A (fr) 1975-02-12
BE814359A (fr) 1974-08-16
US3877981A (en) 1975-04-15

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