JPS5242259A - Method of partially plating multiilayer printed circuit board - Google Patents

Method of partially plating multiilayer printed circuit board

Info

Publication number
JPS5242259A
JPS5242259A JP50117717A JP11771775A JPS5242259A JP S5242259 A JPS5242259 A JP S5242259A JP 50117717 A JP50117717 A JP 50117717A JP 11771775 A JP11771775 A JP 11771775A JP S5242259 A JPS5242259 A JP S5242259A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
partially plating
multiilayer
multiilayer printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50117717A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5739557B2 (2
Inventor
Yukio Takahara
Hitoshi Yamauchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50117717A priority Critical patent/JPS5242259A/ja
Publication of JPS5242259A publication Critical patent/JPS5242259A/ja
Publication of JPS5739557B2 publication Critical patent/JPS5739557B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Multi-Conductor Connections (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP50117717A 1975-10-01 1975-10-01 Method of partially plating multiilayer printed circuit board Granted JPS5242259A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50117717A JPS5242259A (en) 1975-10-01 1975-10-01 Method of partially plating multiilayer printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50117717A JPS5242259A (en) 1975-10-01 1975-10-01 Method of partially plating multiilayer printed circuit board

Publications (2)

Publication Number Publication Date
JPS5242259A true JPS5242259A (en) 1977-04-01
JPS5739557B2 JPS5739557B2 (2) 1982-08-21

Family

ID=14718538

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50117717A Granted JPS5242259A (en) 1975-10-01 1975-10-01 Method of partially plating multiilayer printed circuit board

Country Status (1)

Country Link
JP (1) JPS5242259A (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008204840A (ja) * 2007-02-21 2008-09-04 Japan Aviation Electronics Industry Ltd 基板用コネクタ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008204840A (ja) * 2007-02-21 2008-09-04 Japan Aviation Electronics Industry Ltd 基板用コネクタ

Also Published As

Publication number Publication date
JPS5739557B2 (2) 1982-08-21

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