JPS5244483A - Wire saw - Google Patents

Wire saw

Info

Publication number
JPS5244483A
JPS5244483A JP11974675A JP11974675A JPS5244483A JP S5244483 A JPS5244483 A JP S5244483A JP 11974675 A JP11974675 A JP 11974675A JP 11974675 A JP11974675 A JP 11974675A JP S5244483 A JPS5244483 A JP S5244483A
Authority
JP
Japan
Prior art keywords
wire saw
wire
cutting speed
reduce cut
special
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11974675A
Other languages
Japanese (ja)
Inventor
Masuzo Ikumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP11974675A priority Critical patent/JPS5244483A/en
Publication of JPS5244483A publication Critical patent/JPS5244483A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
    • B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
    • B23D61/185—Saw wires; Saw cables; Twisted saw strips

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Dicing (AREA)

Abstract

PURPOSE:To accelerate cutting speed and to reduce cut-off of thin wire, using a special wire.
JP11974675A 1975-10-06 1975-10-06 Wire saw Pending JPS5244483A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11974675A JPS5244483A (en) 1975-10-06 1975-10-06 Wire saw

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11974675A JPS5244483A (en) 1975-10-06 1975-10-06 Wire saw

Publications (1)

Publication Number Publication Date
JPS5244483A true JPS5244483A (en) 1977-04-07

Family

ID=14769106

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11974675A Pending JPS5244483A (en) 1975-10-06 1975-10-06 Wire saw

Country Status (1)

Country Link
JP (1) JPS5244483A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58184859A (en) * 1982-04-22 1983-10-28 Nec Corp Incoming response system
JPS61121818A (en) * 1984-11-16 1986-06-09 Sumitomo Electric Ind Ltd Wire for wire saw
JPS6438250U (en) * 1987-08-28 1989-03-07
JPS6438249U (en) * 1987-08-28 1989-03-07
US4964209A (en) * 1986-04-17 1990-10-23 Sumitomo Electric Industries, Ltd. Method for producing a wire incrusted with abrasive grain
JPH04188749A (en) * 1990-11-22 1992-07-07 Fuji Electric Co Ltd Manufacture of semiconductor device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58184859A (en) * 1982-04-22 1983-10-28 Nec Corp Incoming response system
JPS61121818A (en) * 1984-11-16 1986-06-09 Sumitomo Electric Ind Ltd Wire for wire saw
US4964209A (en) * 1986-04-17 1990-10-23 Sumitomo Electric Industries, Ltd. Method for producing a wire incrusted with abrasive grain
JPS6438250U (en) * 1987-08-28 1989-03-07
JPS6438249U (en) * 1987-08-28 1989-03-07
JPH04188749A (en) * 1990-11-22 1992-07-07 Fuji Electric Co Ltd Manufacture of semiconductor device

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