JPS5246768A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5246768A
JPS5246768A JP50122501A JP12250175A JPS5246768A JP S5246768 A JPS5246768 A JP S5246768A JP 50122501 A JP50122501 A JP 50122501A JP 12250175 A JP12250175 A JP 12250175A JP S5246768 A JPS5246768 A JP S5246768A
Authority
JP
Japan
Prior art keywords
semiconductor device
leads
moisture resistance
iron wire
copper clad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50122501A
Other languages
Japanese (ja)
Other versions
JPS5436068B2 (en
Inventor
Toshiyuki Hidaka
Takeshi Ishizuka
Masahiro Murakami
Eizo Obara
Ryosuke Morinari
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50122501A priority Critical patent/JPS5246768A/en
Publication of JPS5246768A publication Critical patent/JPS5246768A/en
Publication of JPS5436068B2 publication Critical patent/JPS5436068B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/555—Materials of bond wires of outermost layers of multilayered bond wires, e.g. material of a coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To obtain a semiconductor device having leads of high moisture resistance and weld strength and proper hardness by using an Mo electrode attached with a copper clad iron wire.
COPYRIGHT: (C)1977,JPO&Japio
JP50122501A 1975-10-13 1975-10-13 Semiconductor device Granted JPS5246768A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50122501A JPS5246768A (en) 1975-10-13 1975-10-13 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50122501A JPS5246768A (en) 1975-10-13 1975-10-13 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS5246768A true JPS5246768A (en) 1977-04-13
JPS5436068B2 JPS5436068B2 (en) 1979-11-07

Family

ID=14837396

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50122501A Granted JPS5246768A (en) 1975-10-13 1975-10-13 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5246768A (en)

Also Published As

Publication number Publication date
JPS5436068B2 (en) 1979-11-07

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