JPS5248972A - Circuit board for semiconductor device - Google Patents
Circuit board for semiconductor deviceInfo
- Publication number
- JPS5248972A JPS5248972A JP50125027A JP12502775A JPS5248972A JP S5248972 A JPS5248972 A JP S5248972A JP 50125027 A JP50125027 A JP 50125027A JP 12502775 A JP12502775 A JP 12502775A JP S5248972 A JPS5248972 A JP S5248972A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- semiconductor device
- molded
- board
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: To obtain a touch circuit board of good workability, by forming a circuit on the front and rear of the molded board insert-molded with a lead frame.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50125027A JPS5248972A (en) | 1975-10-17 | 1975-10-17 | Circuit board for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50125027A JPS5248972A (en) | 1975-10-17 | 1975-10-17 | Circuit board for semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5248972A true JPS5248972A (en) | 1977-04-19 |
Family
ID=14900025
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50125027A Pending JPS5248972A (en) | 1975-10-17 | 1975-10-17 | Circuit board for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5248972A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01293645A (en) * | 1988-05-23 | 1989-11-27 | Ibiden Co Ltd | Substrate for mounting of electronic component |
| JPH01302757A (en) * | 1988-05-30 | 1989-12-06 | Ibiden Co Ltd | Substrate assembly sheet |
| US4908933A (en) * | 1988-05-12 | 1990-03-20 | Ibiden Co., Ltd. | Method of manufacturing a substrate for mounting electronic components |
| US4949225A (en) * | 1987-11-10 | 1990-08-14 | Ibiden Co., Ltd. | Circuit board for mounting electronic components |
| FR2646584A1 (en) * | 1989-05-01 | 1990-11-02 | Ibiden Co Ltd | METHOD OF MANUFACTURING PRINTED CIRCUITS FOR ASSEMBLING ELECTRONIC COMPONENTS |
-
1975
- 1975-10-17 JP JP50125027A patent/JPS5248972A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4949225A (en) * | 1987-11-10 | 1990-08-14 | Ibiden Co., Ltd. | Circuit board for mounting electronic components |
| US4908933A (en) * | 1988-05-12 | 1990-03-20 | Ibiden Co., Ltd. | Method of manufacturing a substrate for mounting electronic components |
| JPH01293645A (en) * | 1988-05-23 | 1989-11-27 | Ibiden Co Ltd | Substrate for mounting of electronic component |
| JPH01302757A (en) * | 1988-05-30 | 1989-12-06 | Ibiden Co Ltd | Substrate assembly sheet |
| FR2646584A1 (en) * | 1989-05-01 | 1990-11-02 | Ibiden Co Ltd | METHOD OF MANUFACTURING PRINTED CIRCUITS FOR ASSEMBLING ELECTRONIC COMPONENTS |
| US5022960A (en) * | 1989-05-01 | 1991-06-11 | Ibiden Co., Ltd. | Method of manufacturing circuit board for mounting electronic components |
| US5088008A (en) * | 1989-05-01 | 1992-02-11 | Ibiden Co., Ltd. | Circuit board for mounting electronic components |
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