JPS5249767A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5249767A JPS5249767A JP50125316A JP12531675A JPS5249767A JP S5249767 A JPS5249767 A JP S5249767A JP 50125316 A JP50125316 A JP 50125316A JP 12531675 A JP12531675 A JP 12531675A JP S5249767 A JPS5249767 A JP S5249767A
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- semiconductor device
- flatterned
- formaing
- once
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/019—Manufacture or treatment of bond pads
- H10W72/01951—Changing the shapes of bond pads
- H10W72/01955—Changing the shapes of bond pads by using masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/934—Cross-sectional shape, i.e. in side view
Landscapes
- Wire Bonding (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
PURPOSE: To form flatterned electrodes, by once formaing electrodes in electrode connecting part and extra hole alone then forming fresh electrodes later.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50125316A JPS5249767A (en) | 1975-10-20 | 1975-10-20 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50125316A JPS5249767A (en) | 1975-10-20 | 1975-10-20 | Semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5249767A true JPS5249767A (en) | 1977-04-21 |
Family
ID=14907078
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50125316A Pending JPS5249767A (en) | 1975-10-20 | 1975-10-20 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5249767A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57145340A (en) * | 1981-03-05 | 1982-09-08 | Toshiba Corp | Manufacture of semiconductor device |
| JPS57157545A (en) * | 1981-03-25 | 1982-09-29 | Toshiba Corp | Manufacture of semiconductor device |
| JPS58159757U (en) * | 1982-04-20 | 1983-10-25 | 三洋電機株式会社 | semiconductor equipment |
| JPS62235758A (en) * | 1986-03-21 | 1987-10-15 | インタ−ナショナル・ビジネス・マシ−ンズ・コ−ポレ−ション | Formation of conducting mutual connection |
| JPH02308539A (en) * | 1989-05-23 | 1990-12-21 | Hitachi Ltd | Construction of electrode of semiconductor device |
| US5594280A (en) * | 1987-10-08 | 1997-01-14 | Anelva Corporation | Method of forming a thin film and apparatus of forming a metal thin film utilizing temperature controlling means |
-
1975
- 1975-10-20 JP JP50125316A patent/JPS5249767A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57145340A (en) * | 1981-03-05 | 1982-09-08 | Toshiba Corp | Manufacture of semiconductor device |
| JPS57157545A (en) * | 1981-03-25 | 1982-09-29 | Toshiba Corp | Manufacture of semiconductor device |
| JPS58159757U (en) * | 1982-04-20 | 1983-10-25 | 三洋電機株式会社 | semiconductor equipment |
| JPS62235758A (en) * | 1986-03-21 | 1987-10-15 | インタ−ナショナル・ビジネス・マシ−ンズ・コ−ポレ−ション | Formation of conducting mutual connection |
| US5594280A (en) * | 1987-10-08 | 1997-01-14 | Anelva Corporation | Method of forming a thin film and apparatus of forming a metal thin film utilizing temperature controlling means |
| US5744377A (en) * | 1987-10-08 | 1998-04-28 | Anelva Corporation | Method for forming a thin film and apparatus of forming a metal thin film utilizing temperature controlling means |
| JPH02308539A (en) * | 1989-05-23 | 1990-12-21 | Hitachi Ltd | Construction of electrode of semiconductor device |
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