JPS5261152A - Brazing method - Google Patents

Brazing method

Info

Publication number
JPS5261152A
JPS5261152A JP13702175A JP13702175A JPS5261152A JP S5261152 A JPS5261152 A JP S5261152A JP 13702175 A JP13702175 A JP 13702175A JP 13702175 A JP13702175 A JP 13702175A JP S5261152 A JPS5261152 A JP S5261152A
Authority
JP
Japan
Prior art keywords
brazing method
brazing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13702175A
Other languages
Japanese (ja)
Inventor
Takashi Toyoda
Tooru Horiue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP13702175A priority Critical patent/JPS5261152A/en
Publication of JPS5261152A publication Critical patent/JPS5261152A/en
Pending legal-status Critical Current

Links

JP13702175A 1975-11-14 1975-11-14 Brazing method Pending JPS5261152A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13702175A JPS5261152A (en) 1975-11-14 1975-11-14 Brazing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13702175A JPS5261152A (en) 1975-11-14 1975-11-14 Brazing method

Publications (1)

Publication Number Publication Date
JPS5261152A true JPS5261152A (en) 1977-05-20

Family

ID=15188970

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13702175A Pending JPS5261152A (en) 1975-11-14 1975-11-14 Brazing method

Country Status (1)

Country Link
JP (1) JPS5261152A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61279394A (en) * 1985-06-06 1986-12-10 Mitsubishi Metal Corp Brazed composite member
WO2003064713A1 (en) * 2002-01-30 2003-08-07 Honeywell International Inc. Thermal interface materials; and compositions comprising indium and zinc
US8513800B2 (en) 2006-09-19 2013-08-20 Fujitsu Semiconductor Limited Semiconductor device and method for manufacturing the same
JP2013233577A (en) * 2012-05-10 2013-11-21 Sumitomo Metal Mining Co Ltd Pb FREE In SOLDER ALLOY

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61279394A (en) * 1985-06-06 1986-12-10 Mitsubishi Metal Corp Brazed composite member
WO2003064713A1 (en) * 2002-01-30 2003-08-07 Honeywell International Inc. Thermal interface materials; and compositions comprising indium and zinc
CN100362655C (en) * 2002-01-30 2008-01-16 霍尼韦尔国际公司 Thermal interface material and composition including indium and zinc
US8513800B2 (en) 2006-09-19 2013-08-20 Fujitsu Semiconductor Limited Semiconductor device and method for manufacturing the same
JP2013233577A (en) * 2012-05-10 2013-11-21 Sumitomo Metal Mining Co Ltd Pb FREE In SOLDER ALLOY

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