JPS5270364A - Substrate for resin molded electric circuits - Google Patents

Substrate for resin molded electric circuits

Info

Publication number
JPS5270364A
JPS5270364A JP14635175A JP14635175A JPS5270364A JP S5270364 A JPS5270364 A JP S5270364A JP 14635175 A JP14635175 A JP 14635175A JP 14635175 A JP14635175 A JP 14635175A JP S5270364 A JPS5270364 A JP S5270364A
Authority
JP
Japan
Prior art keywords
substrate
resin molded
electric circuits
molded electric
circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14635175A
Other languages
Japanese (ja)
Inventor
Akira Katayoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Priority to JP14635175A priority Critical patent/JPS5270364A/en
Publication of JPS5270364A publication Critical patent/JPS5270364A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP14635175A 1975-12-10 1975-12-10 Substrate for resin molded electric circuits Pending JPS5270364A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14635175A JPS5270364A (en) 1975-12-10 1975-12-10 Substrate for resin molded electric circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14635175A JPS5270364A (en) 1975-12-10 1975-12-10 Substrate for resin molded electric circuits

Publications (1)

Publication Number Publication Date
JPS5270364A true JPS5270364A (en) 1977-06-11

Family

ID=15405735

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14635175A Pending JPS5270364A (en) 1975-12-10 1975-12-10 Substrate for resin molded electric circuits

Country Status (1)

Country Link
JP (1) JPS5270364A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54124690A (en) * 1978-03-20 1979-09-27 Nec Corp Integrated circuit unit
US7936560B2 (en) 2008-09-24 2011-05-03 Hitachi, Ltd. Cooling device and electronic equipment including cooling device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54124690A (en) * 1978-03-20 1979-09-27 Nec Corp Integrated circuit unit
US7936560B2 (en) 2008-09-24 2011-05-03 Hitachi, Ltd. Cooling device and electronic equipment including cooling device

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